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Nhà > các sản phẩm > Tấm tản nhiệt > TIF700NS High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

TIF700NS High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

Chi tiết sản phẩm

Nguồn gốc: Việt Nam

Hàng hiệu: Ziitek

Chứng nhận: RoHS

Số mô hình: TIF700NS

Điều khoản thanh toán và vận chuyển

Số lượng đặt hàng tối thiểu: 1000 chiếc

Giá bán: 0.1-10 USD/PCS

chi tiết đóng gói: Thùng 24*13*12cm

Thời gian giao hàng: 3-5 ngày làm việc

Điều khoản thanh toán: T/T

Khả năng cung cấp: 100000 chiếc / ngày

Nhận được giá tốt nhất
Làm nổi bật:
Tên sản phẩm:
Vật liệu PAD GAP nhiệt mềm 6,5W hiệu suất cao dành cho bộ xử lý AI Máy chủ AI
Độ dẫn nhiệt:
6,5W/mk
Nguyên vật liệu:
Chất đàn hồi silicon chứa đầy gốm
Từ khóa:
đệm khe hở nhiệt
Màu sắc:
xám
độ cứng:
60/45 (Bờ 00)
Tỷ trọng(g/cm³):
3.4
Ứng dụng:
Bộ xử lý AI Máy chủ AI
Tên sản phẩm:
Vật liệu PAD GAP nhiệt mềm 6,5W hiệu suất cao dành cho bộ xử lý AI Máy chủ AI
Độ dẫn nhiệt:
6,5W/mk
Nguyên vật liệu:
Chất đàn hồi silicon chứa đầy gốm
Từ khóa:
đệm khe hở nhiệt
Màu sắc:
xám
độ cứng:
60/45 (Bờ 00)
Tỷ trọng(g/cm³):
3.4
Ứng dụng:
Bộ xử lý AI Máy chủ AI
TIF700NS High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

TIF700NS High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

 

 Product descriptions

 

The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

 

Features

 

> High thermal conductivity 6.5W/mk
> Good softness and flling
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

 

Application

 

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

> Motherboard chip
> Radiator
> AI Processors AI Servers

Typical Properties of TIF®700NS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.030 0.040~0.200 ASTM D374
(0.25~0.75) (1.00~5.00)
Hardness 60 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5 W/m-K ASTM D5470
6.5W/m-K ISO22007

 

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF700NS High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

FAQ:

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

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