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Nhà > các sản phẩm > Tấm tản nhiệt > TIF100-50-05E Heat Transfer CPU Thermal Pad With 5.0W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

TIF100-50-05E Heat Transfer CPU Thermal Pad With 5.0W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Chi tiết sản phẩm

Nguồn gốc: Việt Nam

Hàng hiệu: Ziitek

Chứng nhận: RoHS

Số mô hình: TIF100-50-05E

Điều khoản thanh toán và vận chuyển

Số lượng đặt hàng tối thiểu: 1000 CÁI

Giá bán: 0.1-10 USD/PCS

chi tiết đóng gói: Thùng 24*13*12cm

Thời gian giao hàng: 3-5 ngày làm việc

Điều khoản thanh toán: T/T

Khả năng cung cấp: 100000 chiếc / ngày

Nhận được giá tốt nhất
Làm nổi bật:
Tên sản phẩm:
Tấm tản nhiệt CPU truyền nhiệt với tấm đệm dẫn nhiệt 5.0W/MK Thích hợp cho thiết bị điện tử cầm tay
Độ dẫn nhiệt:
5.0W/mK
Ứng dụng:
Điện tử cầm tay và thiết bị công nghiệp
vật mẫu:
Mẫu miễn phí
Nguyên vật liệu:
Chất đàn hồi silicon chứa đầy gốm
Tỉ trọng:
3,4g/cm³
Đánh giá ngọn lửa:
94-V0
Màu sắc:
Màu xanh da trời
độ cứng:
65/35 Bờ 00
Từ khóa:
CPU Thermal Pad
Tên sản phẩm:
Tấm tản nhiệt CPU truyền nhiệt với tấm đệm dẫn nhiệt 5.0W/MK Thích hợp cho thiết bị điện tử cầm tay
Độ dẫn nhiệt:
5.0W/mK
Ứng dụng:
Điện tử cầm tay và thiết bị công nghiệp
vật mẫu:
Mẫu miễn phí
Nguyên vật liệu:
Chất đàn hồi silicon chứa đầy gốm
Tỉ trọng:
3,4g/cm³
Đánh giá ngọn lửa:
94-V0
Màu sắc:
Màu xanh da trời
độ cứng:
65/35 Bờ 00
Từ khóa:
CPU Thermal Pad
TIF100-50-05E Heat Transfer CPU Thermal Pad With 5.0W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Heat Transfer CPU Thermal Pad With 5.0W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

 

Product descriptions 

 

TlF®100-50-05E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

Features 

 

> High thermal conductivity : 5.0W/mK
> Good softness and fillability
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

 

 

Application 

 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

 

 

Typical Properties of TIF®100-50-05E Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 6.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012 ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K)

5.0

ASTM D5470
5.0 ISO22007

 

Product Specifications

 

Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X 16" (406 mm X406 mm).

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-50-05E Heat Transfer CPU Thermal Pad With 5.0W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment 0

 

Packaging Details & Lead time 

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

FAQ: 

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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