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Nhà > các sản phẩm > Tấm tản nhiệt > TIF200-04ES Extremely Soft Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

TIF200-04ES Extremely Soft Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

Chi tiết sản phẩm

Nguồn gốc: Việt Nam

Hàng hiệu: Ziitek

Chứng nhận: RoHS

Số mô hình: TIF200-04ES

Điều khoản thanh toán và vận chuyển

Số lượng đặt hàng tối thiểu: 1000 chiếc

Giá bán: 0.1-10 USD/PCS

chi tiết đóng gói: Thùng 24*13*12cm

Thời gian giao hàng: 3-5 ngày làm việc

Điều khoản thanh toán: T/T

Khả năng cung cấp: 100000 chiếc / ngày

Nhận được giá tốt nhất
Làm nổi bật:
Tên sản phẩm:
Tấm đệm nhiệt silicon dẫn nhiệt cực mềm 1.0 W/MK Tấm đệm nhiệt chịu nhiệt
Màu sắc:
Xanh/Hồng
Ứng dụng:
Thiết Bị Chiếu Sáng, Y Tế, Quân Sự, Netcom, Bảng Điều Khiển
Độ dẫn nhiệt:
1,0W/mK
Đánh giá ngọn lửa:
94-V0
Từ khóa:
đệm khe hở nhiệt
Trọng lượng riêng:
1,75g/cm³
độ cứng:
7 Bờ 00
Nguyên vật liệu:
Chất đàn hồi silicon chứa đầy gốm
Vật mẫu:
Mẫu miễn phí
Tên sản phẩm:
Tấm đệm nhiệt silicon dẫn nhiệt cực mềm 1.0 W/MK Tấm đệm nhiệt chịu nhiệt
Màu sắc:
Xanh/Hồng
Ứng dụng:
Thiết Bị Chiếu Sáng, Y Tế, Quân Sự, Netcom, Bảng Điều Khiển
Độ dẫn nhiệt:
1,0W/mK
Đánh giá ngọn lửa:
94-V0
Từ khóa:
đệm khe hở nhiệt
Trọng lượng riêng:
1,75g/cm³
độ cứng:
7 Bờ 00
Nguyên vật liệu:
Chất đàn hồi silicon chứa đầy gốm
Vật mẫu:
Mẫu miễn phí
TIF200-04ES Extremely Soft Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

Extremely Soft Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

  

Product descriptions

 

The TIF®200-04ES Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices, new energy vehicles, and portable electronic devices.

 

Features

 

> Good thermal conductivity
> Extremely soft, low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Puncture-resistant, tear-resistant,and scratch-resistant performance

 

Applications

 

Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®200-04ES Series
Property Value Test method
Color Blue /Pink Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 1.75 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200

(1.00~5.0)

ASTM D374
Hardness 7 Shore 00 7 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥8000 ASTM D149
Dielectric Constant @1MHz 4.9 ASTM D150
Volume Resistivity >1.0X1013 Ohm-meter ASTM D257
Thermal Conductivity(W/m.K) 1.0 ASTM D5470
1.0 ISO22007
Flame rating V-0 UL 94 (E331100)

 

Product Specifications
Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
 
Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF200-04ES Extremely Soft Thermally Conductive  Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Technology Company with a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

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