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TIF200-15-14U 1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad

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Place of Origin: Vietnam

Hàng hiệu: Ziitek

Chứng nhận: RoHS

Model Number: TIF200-15-14U

Điều khoản thanh toán và vận chuyển

Minimum Order Quantity: 1000pcs

Giá bán: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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Products name:
1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad
Materials:
Ceramic filled silicone elastomer
Thermal conductivity:
1.5W/mK
Application:
GPU CPU Chip Display Card Heat Transfer
Specific Gravity:
2.2g/cc
Sample:
Sample free
Flame rating:
94-V0
Hardness:
27±5 Shore 00
Color:
Pink
Keywords:
Thermal Silicone Sheet
Products name:
1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad
Materials:
Ceramic filled silicone elastomer
Thermal conductivity:
1.5W/mK
Application:
GPU CPU Chip Display Card Heat Transfer
Specific Gravity:
2.2g/cc
Sample:
Sample free
Flame rating:
94-V0
Hardness:
27±5 Shore 00
Color:
Pink
Keywords:
Thermal Silicone Sheet
TIF200-15-14U 1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad
TIF200-15-14U 1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad Product descriptions TlF200-15-14U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire

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