https://www.ziitek.com.vn/ 1.0 daily 2026-04-02 https://www.ziitek.com.vn/sale-53768886-tif100-20-11u-electrical-insulation-thermal-conductive-silicone-pad-thermal-pad-thickness-0-5-to-5-0.html 0.8 weekly 2025-12-09 https://www.ziitek.com.vn/photo/pl207609057-tif100_20_11u_electrical_insulation_thermal_conductive_silicone_pad_thermal_pad_thickness_0_5_to_5_0mm_thermal_gap_filler_pad_for_cpu.jpg https://www.ziitek.com.vn/photo/pl207609058-tif100_20_11u_electrical_insulation_thermal_conductive_silicone_pad_thermal_pad_thickness_0_5_to_5_0mm_thermal_gap_filler_pad_for_cpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad For CPU TIF 100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU Product descriptions TlF 100-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53761925-tif800hq-heat-dissipation-silicone-pad-air-gap-filler-thermal-pad-thermal-transfer-thermal-pad-for-m.html 0.8 weekly 2025-12-09 https://www.ziitek.com.vn/photo/pl207585159-tif800hq_heat_dissipation_silicone_pad_air_gap_filler_thermal_pad_thermal_transfer_thermal_pad_for_medical_devices.jpg https://www.ziitek.com.vn/photo/pl207585160-tif800hq_heat_dissipation_silicone_pad_air_gap_filler_thermal_pad_thermal_transfer_thermal_pad_for_medical_devices.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800HQ Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad Thermal Transfer Thermal Pad For Medical Devices TIF800HQ Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad Thermal Transfer Thermal Pad For Medical Devices Product descriptions TlF 800HQ is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TlF 800HQ is an electrically isolating material, which allows its use in applications requiring isolation https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-54912423-tif100d-4035-11-low-oil-yield-thermal-silicon-pad-for-5g-aerospace-ai-aiot-and-automotive.html 0.8 weekly 2026-04-02 https://www.ziitek.com.vn/photo/pl215942858-tif100d_4035_11_low_oil_yield_thermal_silicon_pad_for_5g_aerospace_ai_aiot_and_automotive.jpg https://www.ziitek.com.vn/photo/pl215942859-tif100d_4035_11_low_oil_yield_thermal_silicon_pad_for_5g_aerospace_ai_aiot_and_automotive.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100D 4035-11 Low Oil Yield Thermal Silicon Pad For 5G Aerospace AI AIoT And Automotive Low Oil Yield Thermal Silicon Pad For 5G Aerospace AI AIoT And Automotive The TIF 100L-2040-06 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-54899279-tif100l-2040-06-ultra-low-volatile-d3-d20-siloxane-computer-cpu-gpu-thermal-gap-filler-pad.html 0.8 weekly 2026-03-31 https://www.ziitek.com.vn/photo/pl215791163-tif100l_2040_06_ultra_low_volatile_d3_d20_siloxane_computer_cpu_gpu_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/pl215791164-tif100l_2040_06_ultra_low_volatile_d3_d20_siloxane_computer_cpu_gpu_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100L-2040-06 Ultra-low volatile D3-D20 siloxane Computer CPU GPU Thermal Gap Filler Pad TIF 100L-2040-06 Ultra-low volatile D3-D20 siloxane Computer CPU GPU Thermal Gap Filler Pad The TIF 100L-2040-06 Series thermally conductive interface materials are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.7 https://www.ziitek.com.vn/sale-54898852-tif100l-2020-06-low-volatility-silicone-based-thermal-gap-filler-pad-for-graphics-card-thermal-modul.html 0.8 weekly 2026-03-31 https://www.ziitek.com.vn/photo/pl215789347-tif100l_2020_06_low_volatility_silicone_based_thermal_gap_filler_pad_for_graphics_card_thermal_module.jpg https://www.ziitek.com.vn/photo/pl215789346-tif100l_2020_06_low_volatility_silicone_based_thermal_gap_filler_pad_for_graphics_card_thermal_module.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100L-2020-06 Low Volatility Silicone Based Thermal Gap Filler Pad For Graphics Card Thermal Module TIF 100L-2020-06 Low Volatility Silicone Based Thermal Gap Filler Pad For Graphics Card Thermal Module The TIF 100L-2020-06 Series thermally conductive interface materials are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.5 https://www.ziitek.com.vn/sale-51811322-tif100-h80-11e-good-thermal-conductive-silicone-thermal-pad-for-computer-cpu-gpu.html 0.8 weekly 2026-03-30 https://www.ziitek.com.vn/photo/pl215748635-tif100_h80_11e_good_thermal_conductive_silicone_thermal_pad_for_computer_cpu_gpu.jpg https://www.ziitek.com.vn/photo/pl215748636-tif100_h80_11e_good_thermal_conductive_silicone_thermal_pad_for_computer_cpu_gpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-H80-11E Good Thermal Conductive Silicone Thermal Pad For Computer CPU GPU TIF100-H80-11E Good Thermal Conductive Silicone Thermal Pad For Computer CPU GPU The TIF 100-H80-11E Series is a high-end compressible thermal pad designed to meet top-level cooling requirements while maintaining excellent assembly workmanship.Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-54519945-tif100-50-10e-low-thermal-impedance-5-0w-ultra-soft-thermal-pad-for-network-communications-and-cloud.html 0.8 weekly 2026-03-27 https://www.ziitek.com.vn/photo/pl212600561-tif100_50_10e_low_thermal_impedance_5_0w_ultra_soft_thermal_pad_for_network_communications_and_cloud_computing.jpg https://www.ziitek.com.vn/photo/pl212600560-tif100_50_10e_low_thermal_impedance_5_0w_ultra_soft_thermal_pad_for_network_communications_and_cloud_computing.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-50-10E Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Network Communications And Cloud Computing Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Network Communications And Cloud Computing TIF 100-50-10E Ultra Soft Thermal Pad High thermal conductivity Low thermal impedance Good electrical insulation This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit. Feature Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-54886015-tif100-65-11u-exceptional-thermal-conductivity-rating-of-6-5w-m-k-silicone-based-thermal-gap-pad-fil.html 0.8 weekly 2026-03-27 https://www.ziitek.com.vn/photo/pl215645694-tif100_65_11u_exceptional_thermal_conductivity_rating_of_6_5w_m_k_silicone_based_thermal_gap_pad_filler_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl215645691-tif100_65_11u_exceptional_thermal_conductivity_rating_of_6_5w_m_k_silicone_based_thermal_gap_pad_filler_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-65-11U Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers Product descriptions The TIF 100-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-54027902-tif100-40-05u-high-quality-high-conductive-thermal-silicone-pad-cooling-gap-filler-for-cpu-premium-i.html 0.8 weekly 2026-03-27 https://www.ziitek.com.vn/photo/pl208668406-tif100_40_05u_high_quality_high_conductive_thermal_silicone_pad_cooling_gap_filler_for_cpu_premium_insulation_element.jpg https://www.ziitek.com.vn/photo/pl208668407-tif100_40_05u_high_quality_high_conductive_thermal_silicone_pad_cooling_gap_filler_for_cpu_premium_insulation_element.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-40-05U High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element TIF100-40-05U High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Ziitek TIF 100-40-05U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good thermal conductive: 4.0W/mK https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.6 https://www.ziitek.com.vn/sale-53755630-tif500-40-11us-4-0w-mk-insulation-gap-filler-silicone-pad-thermal-conductive-silicone-pad-for-cpu-gp.html 0.8 weekly 2026-03-26 https://www.ziitek.com.vn/photo/pl207563574-tif500_40_11us_4_0w_mk_insulation_gap_filler_silicone_pad_thermal_conductive_silicone_pad_for_cpu_gpu_ev_battery.jpg https://www.ziitek.com.vn/photo/pl207563573-tif500_40_11us_4_0w_mk_insulation_gap_filler_silicone_pad_thermal_conductive_silicone_pad_for_cpu_gpu_ev_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery Product descriptions TIF 500-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-53743752-tif700res-high-temperature-8-5w-custom-silicone-gap-filler-electric-thermal-pads-for-gpu-cpu-led.html 0.8 weekly 2026-03-26 https://www.ziitek.com.vn/photo/pl207529840-tif700res_high_temperature_8_5w_custom_silicone_gap_filler_electric_thermal_pads_for_gpu_cpu_led.jpg https://www.ziitek.com.vn/photo/pl207529841-tif700res_high_temperature_8_5w_custom_silicone_gap_filler_electric_thermal_pads_for_gpu_cpu_led.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg TIF700RES High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads for Gpu Cpu Led TIF700RES High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads for Gpu Cpu Led Product descriptions TIF 700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.3 https://www.ziitek.com.vn/sale-54868918-tif500-30-11us-as-great-thermal-conductivity-thermal-pad-for-computer-cpu-gpu-cooling.html 0.8 weekly 2026-03-25 https://www.ziitek.com.vn/photo/pl215438314-tif500_30_11us_as_great_thermal_conductivity_thermal_pad_for_computer_cpu_gpu_cooling.jpg https://www.ziitek.com.vn/photo/pl215438313-tif500_30_11us_as_great_thermal_conductivity_thermal_pad_for_computer_cpu_gpu_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-30-11US-AS Great Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling Great Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling Product descriptions TlF 500-30-11U-AS series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-54868547-tif200-30-16s-ultra-soft-ai-servers-thermal-conductive-gap-filler-pads-with-varies-thickness.html 0.8 weekly 2026-03-25 https://www.ziitek.com.vn/photo/pl215434996-tif200_30_16s_ultra_soft_ai_servers_thermal_conductive_gap_filler_pads_with_varies_thickness.jpg https://www.ziitek.com.vn/photo/pl215434997-tif200_30_16s_ultra_soft_ai_servers_thermal_conductive_gap_filler_pads_with_varies_thickness.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF200-30-16S Ultra Soft AI Servers Thermal Conductive Gap Filler Pads With Varies Thickness Ultra Soft AI Servers Thermal Conductive Gap Filler Pads With Varies Thickness Product descriptions TIF 200-30-16S Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-54859326-tif080-11-gray-excellent-thermal-conductivity-8-0w-thermal-conductive-gel-for-telecom-industry.html 0.8 weekly 2026-03-23 https://www.ziitek.com.vn/photo/pl215346732-tif080_11_gray_excellent_thermal_conductivity_8_0w_thermal_conductive_gel_for_telecom_industry.jpg https://www.ziitek.com.vn/photo/pl215346791-tif080_11_gray_excellent_thermal_conductivity_8_0w_thermal_conductive_gel_for_telecom_industry.jpg https://www.ziitek.com.vn/sale-53566714-tic800h-sp-superior-reliable-thermal-performance-thermal-phase-change-material-for-power-conversion-.html 0.8 weekly 2026-03-23 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https://www.ziitek.com.vn/photo/pl206382356-tif_100_20_11s_electric_insulation_thermal_pad_thermally_conductive_silicon_protective_cushioning_material.jpg https://www.ziitek.com.vn/photo/pl206382357-tif_100_20_11s_electric_insulation_thermal_pad_thermally_conductive_silicon_protective_cushioning_material.jpg https://www.ziitek.com.vn/sale-53153206-tif100-07s-silicone-thermal-pad-gpu-ssd-thermal-pad.html 0.8 weekly 2026-03-23 https://www.ziitek.com.vn/photo/pl205312344-tif100_07s_silicone_thermal_pad_gpu_ssd_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205312343-tif100_07s_silicone_thermal_pad_gpu_ssd_thermal_pad.jpg https://www.ziitek.com.vn/sale-53144093-tif800q-free-sample-heat-transfer-thermal-silicone-pad-for-cpu.html 0.8 weekly 2026-03-23 https://www.ziitek.com.vn/photo/pl205276496-tif800q_free_sample_heat_transfer_thermal_silicone_pad_for_cpu.jpg https://www.ziitek.com.vn/photo/pl205276497-tif800q_free_sample_heat_transfer_thermal_silicone_pad_for_cpu.jpg https://www.ziitek.com.vn/sale-53139950-tif600p-premium-soft-silicone-thermal-pad-for-advanced-cooling-needs.html 0.8 weekly 2026-03-23 https://www.ziitek.com.vn/photo/pl205260670-tif600p_premium_soft_silicone_thermal_pad_for_advanced_cooling_needs.jpg https://www.ziitek.com.vn/photo/pl205260669-tif600p_premium_soft_silicone_thermal_pad_for_advanced_cooling_needs.jpg https://www.ziitek.com.vn/sale-51623384-tie380-45-single-component-thermal-conductive-epoxy-glue-for-pcb-board-heat-dissipation-treatment.html 0.8 weekly 2026-03-20 https://www.ziitek.com.vn/photo/pl201837406-tie380_45_single_component_thermal_conductive_epoxy_glue_for_pcb_board_heat_dissipation_treatment.jpg https://www.ziitek.com.vn/photo/pl215227987-tie380_45_single_component_thermal_conductive_epoxy_glue_for_pcb_board_heat_dissipation_treatment.jpg https://www.ziitek.com.vn/sale-53800747-tif100-30-11e-thermal-pads-pliable-durable-gray-electric-conductive-silicone-sheet-for-electronics.html 0.8 weekly 2026-03-19 https://www.ziitek.com.vn/photo/pl207727586-tif100_30_11e_thermal_pads_pliable_durable_gray_electric_conductive_silicone_sheet_for_electronics.jpg https://www.ziitek.com.vn/photo/pl207727587-tif100_30_11e_thermal_pads_pliable_durable_gray_electric_conductive_silicone_sheet_for_electronics.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11E Thermal Pads Pliable Durable Gray Electric Conductive Silicone Sheet For Electronics TIF100-30-11E Thermal Pads Pliable Durable Gray Electric Conductive Silicone Sheet For Electronics The TIF 100-30-11E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity_and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.It is an ideal choice for https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-54835819-z-paster100-6060-11-good-performance-non-silicone-thermal-gap-pad-for-automotive-electronics.html 0.8 weekly 2026-03-18 https://www.ziitek.com.vn/photo/pl215121024-z_paster100_6060_11_good_performance_non_silicone_thermal_gap_pad_for_automotive_electronics.jpg https://www.ziitek.com.vn/photo/pl215121025-z_paster100_6060_11_good_performance_non_silicone_thermal_gap_pad_for_automotive_electronics.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg Z-Paster100 6060-11 Good Performance Non Silicone Thermal Gap Pad For Automotive Electronics Good Performance Non Silicone Thermal Gap Pad For Automotive Electronics The Z-Paster 100 6060-11series is a siloxane-free thermally conductive interface material applied to fll the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52756908-tig7835l-liquid-metal-thermal-paste-for-cpu-gpu-cooling-pc-amd-intel-processor-cooler-thermal-paste.html 0.8 weekly 2026-03-18 https://www.ziitek.com.vn/photo/pl204556934-tig7835l_liquid_metal_thermal_paste_for_cpu_gpu_cooling_pc_amd_intel_processor_cooler_thermal_paste.jpg https://www.ziitek.com.vn/sale-52756838-tic800m-high-thermal-conductive-metal-phase-changing-materials-for-microprocessors-chipsets.html 0.8 weekly 2026-03-17 https://www.ziitek.com.vn/photo/pl204556077-tic800m_high_thermal_conductive_metal_phase_changing_materials_for_microprocessors_chipsets.jpg https://www.ziitek.com.vn/photo/pl204556078-tic800m_high_thermal_conductive_metal_phase_changing_materials_for_microprocessors_chipsets.jpg https://www.ziitek.com.vn/sale-54827388-tig680-28ab-2-8w-mk-high-thermal-conductive-two-component-potting-silicone-adhesive-for-high-voltage.html 0.8 weekly 2026-03-17 https://www.ziitek.com.vn/photo/pl214983990-tig680_28ab_2_8w_mk_high_thermal_conductive_two_component_potting_silicone_adhesive_for_high_voltage_package_relay.jpg https://www.ziitek.com.vn/photo/pl214983991-tig680_28ab_2_8w_mk_high_thermal_conductive_two_component_potting_silicone_adhesive_for_high_voltage_package_relay.jpg https://www.ziitek.com.vn/sale-54817475-tif100-60-01u-ultra-soft-thermally-conductive-sheet-for-electronic-products-energy-storage-industria.html 0.8 weekly 2026-03-16 https://www.ziitek.com.vn/photo/pl214823172-tif100_60_01u_ultra_soft_thermally_conductive_sheet_for_electronic_products_energy_storage_industrial.jpg https://www.ziitek.com.vn/photo/pl214823183-tif100_60_01u_ultra_soft_thermally_conductive_sheet_for_electronic_products_energy_storage_industrial.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-60-01U Ultra-Soft Thermally Conductive Sheet For Electronic Products Energy Storage Industrial TIF 100-60-01U Ultra-Soft Thermally Conductive Sheet For Electronic Products Energy Storage Industrial Product descriptions The TIF 100-60-01U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.9 https://www.ziitek.com.vn/sale-51842563-tif600gp-garnet-6-0w-thermal-conductivity-silicone-thermal-pads-for-led-tv-and-led-lit-lamps.html 0.8 weekly 2026-03-13 https://www.ziitek.com.vn/photo/pl202778842-tif600gp_garnet_6_0w_thermal_conductivity_silicone_thermal_pads_for_led_tv_and_led_lit_lamps.jpg https://www.ziitek.com.vn/photo/pl202778843-tif600gp_garnet_6_0w_thermal_conductivity_silicone_thermal_pads_for_led_tv_and_led_lit_lamps.jpg https://www.ziitek.com.vn/sale-52058730-1-5w-mk-thermal-conductivity-tif100-05e-silicone-thermal-adhesive-pads-for-gpu-cooling.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203295426-1_5w_mk_thermal_conductivity_tif100_05e_silicone_thermal_adhesive_pads_for_gpu_cooling.jpg https://www.ziitek.com.vn/photo/pl203295425-1_5w_mk_thermal_conductivity_tif100_05e_silicone_thermal_adhesive_pads_for_gpu_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-426393.jpg 1.5W/MK Thermal Conductivity TIF100-05E Silicone Thermal Adhesive Pads For GPU Cooling 1.5W/MK Thermal Conductivity TIF 100-05E Silicone Thermal Adhesive Pads For GPU Cooling Product descriptions TlF 100-05E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low stress https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/3fe4edf010c66adb88f6abe19bc51dd3/playlist.m3u8 10 2026-03-12T11:46:22+08:00 4 4.8 https://www.ziitek.com.vn/sale-51877152-silicone-tif200-02e-gpu-laptop-thermal-conductive-silicon-heating-thermal-pad-for-cpu-for-heat-sink.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203192210-silicone_tif200_02e_gpu_laptop_thermal_conductive_silicon_heating_thermal_pad_for_cpu_for_heat_sink.jpg https://www.ziitek.com.vn/photo/pl203192211-silicone_tif200_02e_gpu_laptop_thermal_conductive_silicon_heating_thermal_pad_for_cpu_for_heat_sink.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg Silicone TIF200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink Silicone TIF 200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink Product descriptions TlF 200-02E series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.9 https://www.ziitek.com.vn/sale-52068857-ultra-soft-tif100-20-50e-pink-thermally-conductive-pad-for-led-tv-heat-dissipation.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203328881-ultra_soft_tif100_20_50e_pink_thermally_conductive_pad_for_led_tv_heat_dissipation.jpg https://www.ziitek.com.vn/photo/pl203328880-ultra_soft_tif100_20_50e_pink_thermally_conductive_pad_for_led_tv_heat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg Ultra Soft TIF100-20-50E Pink Thermally Conductive Pad For LED/TV Heat Dissipation Ultra Soft TIF 100-20-50E Pink Thermally Conductive Pad For LED/TV Heat Dissipation Product descriptions TlF 100-20-50E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.2 https://www.ziitek.com.vn/sale-53102097-tif200-20-02es-ultra-soft-cpu-thermal-pad-for-telecommunication-hardware.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl205105714-tif200_20_02es_ultra_soft_cpu_thermal_pad_for_telecommunication_hardware.jpg https://www.ziitek.com.vn/photo/pl205105713-tif200_20_02es_ultra_soft_cpu_thermal_pad_for_telecommunication_hardware.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-20-02ES Ultra Soft CPU Thermal Pad For Telecommunication Hardware TIF200-20-02ES Ultra Soft CPU Thermal Pad For Telecommunication Hardware Product descriptions TlFTM200-20-02ES is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIFTM200-20-02ES is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.9 https://www.ziitek.com.vn/sale-53095953-tif200-20-14s-thermal-interface-material-silicone-thermal-pads-for-new-energy-vehicle-batteries.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl205087226-tif200_20_14s_thermal_interface_material_silicone_thermal_pads_for_new_energy_vehicle_batteries.jpg https://www.ziitek.com.vn/photo/pl205087227-tif200_20_14s_thermal_interface_material_silicone_thermal_pads_for_new_energy_vehicle_batteries.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-20-14S Thermal Interface Material Silicone Thermal Pads For New Energy Vehicle Batteries TIF200-20-14S Thermal Interface Material Silicone Thermal Pads For New Energy Vehicle Batteries Product descriptions TlF200-20-14S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.5 https://www.ziitek.com.vn/sale-51793778-tif100-16-38uf-silicone-thermal-pad-thermal-gap-filler-pad.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl202721684-tif100_16_38uf_silicone_thermal_pad_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/pl202721685-tif100_16_38uf_silicone_thermal_pad_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-16-38UF Silicone Thermal Pad Thermal Gap Filler Pad TIF 100-16-38UF Silicone thermal pad thermal gap filler pad The TIF 100-16-38UF series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.8 https://www.ziitek.com.vn/sale-54132017-tif100-6045-50-silicone-thermal-conductive-pad-fiberglass-reinforce-thermal-insulation-sheet-for-com.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl209131531-tif100_6045_50_silicone_thermal_conductive_pad_fiberglass_reinforce_thermal_insulation_sheet_for_computer_cpu_gpu_cooling.jpg https://www.ziitek.com.vn/photo/pl209131530-tif100_6045_50_silicone_thermal_conductive_pad_fiberglass_reinforce_thermal_insulation_sheet_for_computer_cpu_gpu_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100 6045-50 Silicone Thermal Conductive Pad Fiberglass Reinforce Thermal Insulation Sheet For Computer CPU/GPU Cooling TIF 100 6045-50 Silicone Thermal Conductive Pad Fiberglass Reinforce Thermal Insulation Sheet For Computer CPU/GPU Cooling Product descriptions TIF 100 6045-50 is a well-balanced, general-purpose thermal conductive pad. It offers excellent thermal conductivity and moderate hardness. This balanced design ensures both superior surface conformability and exceptional ease of handling, providing effective thermal transfer paths and fundamental physicalprotection for a wide range https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-54059558-tif200-02u-signal-communication-thermal-pad-1-5w-0-5mm-5-0mm-thickness-thermal-gap-filler-pad-for-ne.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl208810335-tif200_02u_signal_communication_thermal_pad_1_5w_0_5mm_5_0mm_thickness_thermal_gap_filler_pad_for_new_energy_vehicle.jpg https://www.ziitek.com.vn/photo/pl208810334-tif200_02u_signal_communication_thermal_pad_1_5w_0_5mm_5_0mm_thickness_thermal_gap_filler_pad_for_new_energy_vehicle.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-02U Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle TIF200-02U Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle Product descriptions Ziitek TlF 200-02U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TlF 200-02U is an electrically isolating material, which allows its use in applications https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-54136803-tif100-10055-50-silicone-thermal-pad-blue-wholesale-silicone-rubber-thermal-insulation-pad-thermal-s.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl209150993-tif100_10055_50_silicone_thermal_pad_blue_wholesale_silicone_rubber_thermal_insulation_pad_thermal_silicone_pad_with_adhesive_for_5g_base_stations.jpg https://www.ziitek.com.vn/photo/pl209150994-tif100_10055_50_silicone_thermal_pad_blue_wholesale_silicone_rubber_thermal_insulation_pad_thermal_silicone_pad_with_adhesive_for_5g_base_stations.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100 10055-50 Silicone Thermal Pad Blue Wholesale Silicone Rubber Thermal Insulation Pad Thermal Silicone Pad With Adhesive For 5G Base Stations TIF100 10055-50 Silicone Thermal Pad Blue Wholesale Silicone Rubber Thermal Insulation Pad Thermal Silicone Pad With Adhesive For 5G Base Stations The TIF 100 10055-50 Series a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-53102600-tif200-30-50s-insulation-silicone-thermal-pad-thermal-gap-filler-pad-for-ev-battery.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl205107984-tif200_30_50s_insulation_silicone_thermal_pad_thermal_gap_filler_pad_for_ev_battery.jpg https://www.ziitek.com.vn/photo/pl205107985-tif200_30_50s_insulation_silicone_thermal_pad_thermal_gap_filler_pad_for_ev_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-30-50S Insulation Silicone Thermal Pad Thermal Gap Filler Pad For Ev Battery TIF200-30-50S Insulation Silicone Thermal Pad Thermal Gap Filler Pad For Ev Battery Product descriptions TlFTM200-30-50S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts > Soft and compressible for low https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.2 https://www.ziitek.com.vn/sale-54433278-tif100-15-14s-high-compliance-1-5w-thermally-conductive-gap-filler-pads-for-ai-processors-ai-servers.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl211799210-tif100_15_14s_high_compliance_1_5w_thermally_conductive_gap_filler_pads_for_ai_processors_ai_servers_heat_dissipation.jpg https://www.ziitek.com.vn/photo/pl211799211-tif100_15_14s_high_compliance_1_5w_thermally_conductive_gap_filler_pads_for_ai_processors_ai_servers_heat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-15-14S High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation Product descriptions The TIF 100-15-14S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.2 https://www.ziitek.com.vn/sale-53139085-tif600g-silicone-thermal-pads-thermal-conductive-gap-filler-for-car-battery-and-power-supply.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl205257986-tif600g_silicone_thermal_pads_thermal_conductive_gap_filler_for_car_battery_and_power_supply.jpg https://www.ziitek.com.vn/photo/pl205257987-tif600g_silicone_thermal_pads_thermal_conductive_gap_filler_for_car_battery_and_power_supply.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF600G Silicone Thermal Pads Thermal Conductive Gap Filler For Car Battery And Power Supply TIF600G Silicone Thermal Pads Thermal Conductive Gap Filler For Car Battery And Power Supply Product descriptions TlF600G series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.4 https://www.ziitek.com.vn/sale-53356567-tif200-10-02u-high-quality-thermal-pad-conductive-silicone-thermal-heating-pad-gpu.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl206046867-tif200_10_02u_high_quality_thermal_pad_conductive_silicone_thermal_heating_pad_gpu.jpg https://www.ziitek.com.vn/photo/pl206046866-tif200_10_02u_high_quality_thermal_pad_conductive_silicone_thermal_heating_pad_gpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-10-02U High Quality Thermal Pad Conductive Silicone Thermal Heating Pad Gpu TIF200-10-02U High Quality Thermal Pad Conductive Silicone Thermal Heating Pad Gpu Product descriptions TlF200-10-02U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.8 https://www.ziitek.com.vn/sale-53606066-tif200-15-14u-1-5w-mk-cooling-gap-filler-insulation-thermal-silicone-sheet-high-conductive-thermal-p.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl206959693-tif200_15_14u_1_5w_mk_cooling_gap_filler_insulation_thermal_silicone_sheet_high_conductive_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl206959692-tif200_15_14u_1_5w_mk_cooling_gap_filler_insulation_thermal_silicone_sheet_high_conductive_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-15-14U 1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad TIF200-15-14U 1.5W/MK Cooling Gap Filler Insulation Thermal Silicone Sheet High Conductive Thermal Pad Product descriptions TlF200-15-14U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.4 https://www.ziitek.com.vn/sale-53615171-tif200-30-25s-thermal-conductive-pad-thermal-insulation-silicone-pad-thermal-gap-pad-for-cpu-led-pcb.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl206995367-tif200_30_25s_thermal_conductive_pad_thermal_insulation_silicone_pad_thermal_gap_pad_for_cpu_led_pcb_gpu_ssd.jpg https://www.ziitek.com.vn/photo/pl206995366-tif200_30_25s_thermal_conductive_pad_thermal_insulation_silicone_pad_thermal_gap_pad_for_cpu_led_pcb_gpu_ssd.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-30-25S Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD TIF200-30-25S Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD Product descriptions TlF200-30-25S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-53587337-tif100-20-25s-soft-and-compressible-led-floot-light-2-0w-mk-pink-silicone-thermal-conductivity-pad.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl206882013-tif100_20_25s_soft_and_compressible_led_floot_light_2_0w_mk_pink_silicone_thermal_conductivity_pad.jpg https://www.ziitek.com.vn/photo/pl206882015-tif100_20_25s_soft_and_compressible_led_floot_light_2_0w_mk_pink_silicone_thermal_conductivity_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-20-25S Soft And Compressible LED Floot Light 2.0W/MK Pink Silicone Thermal Conductivity Pad TIF100-20-25S Soft And Compressible LED Floot Light 2.0W/MK Pink Silicone Thermal Conductivity Pad Product descriptions TlF100-20-25S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 2.0W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-53675569-tif100-20-50s-thermally-conductive-gap-filler-pads-series-for-graphics-card-thermal-module.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl207268122-tif100_20_50s_thermally_conductive_gap_filler_pads_series_for_graphics_card_thermal_module.jpg https://www.ziitek.com.vn/photo/pl207268123-tif100_20_50s_thermally_conductive_gap_filler_pads_series_for_graphics_card_thermal_module.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-20-50S Thermally Conductive Gap Filler Pads Series for Graphics Card Thermal Module TIF100-20-50S Thermally Conductive Gap Filler Pads Series for Graphics Card Thermal Module Product descriptions TlFTM100-20-50S Series thermally conductive interface materials are applied to fill he air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.3 https://www.ziitek.com.vn/sale-54459155-tif100-50-50e-good-flexibility-and-fillability-silicone-based-thermally-gap-pad-filler-for-ai-proces.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl212064489-tif100_50_50e_good_flexibility_and_fillability_silicone_based_thermally_gap_pad_filler_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl212064488-tif100_50_50e_good_flexibility_and_fillability_silicone_based_thermally_gap_pad_filler_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-50-50E Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers TIF 100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-53894888-tif100-30-25s-silicone-self-adhesive-thermal-pad-45-shore-00-for-led-bulb-lights.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl208096815-tif100_30_25s_silicone_self_adhesive_thermal_pad_45_shore_00_for_led_bulb_lights.jpg https://www.ziitek.com.vn/photo/pl208096814-tif100_30_25s_silicone_self_adhesive_thermal_pad_45_shore_00_for_led_bulb_lights.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-30-25S Silicone Self Adhesive Thermal Pad 45 Shore 00 For LED Bulb Lights TIF100-30-25S Silicone Self Adhesive Thermal Pad 45 Shore 00 For LED Bulb Lights Product descriptions TlF 100-30-25S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.1 https://www.ziitek.com.vn/sale-52135840-tif100-30-25e-ultra-soft-3-0w-silicon-thermal-gap-filler-pad-for-pc-dvr-digital-video-recorder-set-t.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203584778-tif100_30_25e_ultra_soft_3_0w_silicon_thermal_gap_filler_pad_for_pc_dvr_digital_video_recorder_set_top_box_applied.jpg https://www.ziitek.com.vn/photo/pl203584775-tif100_30_25e_ultra_soft_3_0w_silicon_thermal_gap_filler_pad_for_pc_dvr_digital_video_recorder_set_top_box_applied.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-30-25E Ultra Soft 3.0W Silicon Thermal Gap Filler Pad For PC DVR Digital Video Recorder Set Top Box Applied TIF 100-30-25E Ultra Soft 3.0W Silicon Thermal Gap Filler Pad For PC DVR Digital Video Recorder Set Top Box Applied Product descriptions TlF 100-30-25E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.6 https://www.ziitek.com.vn/sale-53987268-tif100-40-05s-high-strength-high-temperature-resistant-thermal-silicon-insulator-pad-for-battery.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl208511447-tif100_40_05s_high_strength_high_temperature_resistant_thermal_silicon_insulator_pad_for_battery.jpg https://www.ziitek.com.vn/photo/pl208511446-tif100_40_05s_high_strength_high_temperature_resistant_thermal_silicon_insulator_pad_for_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-40-05S High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad For Battery High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad For Battery Product descriptions TlF 100-40-05S Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.1 https://www.ziitek.com.vn/sale-53951936-tif200-20-14e-oem-customized-size-thermal-conductive-pad-thermal-conductive-silicon-pad.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl208374568-tif200_20_14e_oem_customized_size_thermal_conductive_pad_thermal_conductive_silicon_pad.jpg https://www.ziitek.com.vn/photo/pl208374567-tif200_20_14e_oem_customized_size_thermal_conductive_pad_thermal_conductive_silicon_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF200-20-14E OEM Customized Size Thermal Conductive Pad Thermal Conductive Silicon Pad TIF 200-20-14E OEM Customized Size Thermal Conductive Pad Thermal Conductive Silicon Pad Product descriptions TlF 200-20-14E Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 2.0W/mK > Moldability for complex parts > Soft and compressible https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.7 https://www.ziitek.com.vn/sale-52076301-tif100-15-25e-factory-price-hot-selling-thermal-conductive-silicon-pad-for-motor-heat-disperse.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203355914-tif100_15_25e_factory_price_hot_selling_thermal_conductive_silicon_pad_for_motor_heat_disperse.jpg https://www.ziitek.com.vn/photo/pl203355915-tif100_15_25e_factory_price_hot_selling_thermal_conductive_silicon_pad_for_motor_heat_disperse.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-15-25E Factory Price Hot Selling Thermal Conductive Silicon Pad For Motor Heat Disperse Factory Price Hot Selling Thermal Conductive Silicon Pad For Motor Heat Disperse Product descriptions TlF 100-15-25E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.8 https://www.ziitek.com.vn/sale-52068927-tif100-20-50f-pink-thermally-conductive-pad-for-unmanned-droneheat-dissipation.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203329115-tif100_20_50f_pink_thermally_conductive_pad_for_unmanned_droneheat_dissipation.jpg https://www.ziitek.com.vn/photo/pl203329116-tif100_20_50f_pink_thermally_conductive_pad_for_unmanned_droneheat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-20-50F Pink Thermally Conductive Pad For Unmanned DroneHeat Dissipation TIF 100-20-50F Pink Thermally Conductive Pad For Unmanned DroneHeat Dissipation Product descriptions TlF 100-20-50F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for complex parts > Soft and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.4 https://www.ziitek.com.vn/sale-52084680-tif100-30-50s-gray-color-thermal-pad-for-cpu-gpu-psu.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203380799-tif100_30_50s_gray_color_thermal_pad_for_cpu_gpu_psu.jpg https://www.ziitek.com.vn/photo/pl203380797-tif100_30_50s_gray_color_thermal_pad_for_cpu_gpu_psu.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-30-50S Gray Color Thermal Pad For CPU GPU PSU Gray Color Thermal Pad For CPU GPU PSU Product descriptions TlF 100-30-50S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts > Soft and compressible for low stress applications > Easy release construction > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.4 https://www.ziitek.com.vn/sale-52113868-tif100-30-50e-3w-m-k-die-cutting-custom-size-silicone-heat-insulation-thermal-conductive-pad-for-swi.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl203531838-tif100_30_50e_3w_m_k_die_cutting_custom_size_silicone_heat_insulation_thermal_conductive_pad_for_switching_power.jpg https://www.ziitek.com.vn/photo/pl203531837-tif100_30_50e_3w_m_k_die_cutting_custom_size_silicone_heat_insulation_thermal_conductive_pad_for_switching_power.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-cooling-solution-426390.jpg TIF100-30-50E 3W/M.K Die Cutting Custom Size Silicone Heat Insulation Thermal Conductive Pad For Switching Power 3W/M.K Die Cutting Custom Size Silicone Heat Insulation Thermal Conductive Pad For Switching Power Product descriptions TlF 100-30-50E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts > Soft and compressib https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/12075a9f02a33eb9b98f395cf4ae75e0/playlist.m3u8 9 2026-03-12T11:43:59+08:00 4 4.5 https://www.ziitek.com.vn/sale-53095687-tif200-10-02s-thermally-conductive-pad-gap-filler-thermal-pads-heat-transfer.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl205085914-tif200_10_02s_thermally_conductive_pad_gap_filler_thermal_pads_heat_transfer.jpg https://www.ziitek.com.vn/photo/pl205085913-tif200_10_02s_thermally_conductive_pad_gap_filler_thermal_pads_heat_transfer.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-powerhouse-pad-426332.jpg TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer TIF 200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer Product descriptions TlF 200-10-02s Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/bc5885caeab003f4929b8f98acfb3599/playlist.m3u8 11 2026-03-12T11:08:38+08:00 4 4.7 https://www.ziitek.com.vn/sale-54800215-tif100-50-11us-silicone-based-gap-pad-filler-ultra-soft-thermal-gap-pad-materials-for-ai-processors-.html 0.8 weekly 2026-03-12 https://www.ziitek.com.vn/photo/pl214633360-tif100_50_11us_silicone_based_gap_pad_filler_ultra_soft_thermal_gap_pad_materials_for_ai_processors_ai_servers_smart_home_telecom.jpg https://www.ziitek.com.vn/photo/pl214633359-tif100_50_11us_silicone_based_gap_pad_filler_ultra_soft_thermal_gap_pad_materials_for_ai_processors_ai_servers_smart_home_telecom.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-50-11US Silicone-Based Gap Pad Filler Ultra-Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom TIF100-50-11US Silicone-Based Gap Pad Filler Ultra-Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom Product descriptions The TIF 100-50-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-54795559-tif100-50-11es-low-thermal-impedance-ultra-soft-thermal-pad-for-5g-aerospace-ai-electric-vehicle.html 0.8 weekly 2026-03-11 https://www.ziitek.com.vn/photo/pl214576595-tif100_50_11es_low_thermal_impedance_ultra_soft_thermal_pad_for_5g_aerospace_ai_electric_vehicle.jpg https://www.ziitek.com.vn/photo/pl214576593-tif100_50_11es_low_thermal_impedance_ultra_soft_thermal_pad_for_5g_aerospace_ai_electric_vehicle.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-50-11ES Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle Product descriptions The TIF 100-50-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-54076875-tif100-40-11us-multiple-thickness-factory-thermal-pad-thermally-conductive-silicone-pad-for-electric.html 0.8 weekly 2026-03-10 https://www.ziitek.com.vn/photo/pl208873579-tif100_40_11us_multiple_thickness_factory_thermal_pad_thermally_conductive_silicone_pad_for_electric_products.jpg https://www.ziitek.com.vn/photo/pl208873580-tif100_40_11us_multiple_thickness_factory_thermal_pad_thermally_conductive_silicone_pad_for_electric_products.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-40-11US Multiple Thickness Factory Thermal Pad Thermally Conductive Silicone Pad For Electric Products TIF100-40-11US Multiple Thickness Factory Thermal Pad Thermally Conductive Silicone Pad For Electric Products Product descriptions The TIF 100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit.It is suitable for addressing issues such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-53087830-tif700nus-gray-soft-silicone-thermal-pad-6-5w-high-thermal-conductivity-for-electronics-cooling.html 0.8 weekly 2026-03-09 https://www.ziitek.com.vn/photo/pl214453679-tif700nus_gray_soft_silicone_thermal_pad_6_5w_high_thermal_conductivity_for_electronics_cooling.jpg https://www.ziitek.com.vn/photo/pl214453677-tif700nus_gray_soft_silicone_thermal_pad_6_5w_high_thermal_conductivity_for_electronics_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling Product descriptions TIF 700NUS series of thermal interface materials is specficlly designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tighty to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-54784218-good-thermal-conductivity-silicone-based-thermal-conductive-paste-for-semiconductor-automatic-labora.html 0.8 weekly 2026-03-09 https://www.ziitek.com.vn/photo/pl214432203-good_thermal_conductivity_silicone_based_thermal_conductive_paste_for_semiconductor_automatic_laboratory_equipment.jpg https://www.ziitek.com.vn/photo/pl214432204-good_thermal_conductivity_silicone_based_thermal_conductive_paste_for_semiconductor_automatic_laboratory_equipment.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg Good Thermal Conductivity Silicone-Based Thermal Conductive Paste For Semiconductor Automatic Laboratory Equipment Good Thermal Conductivity Silicone-Based Thermal Conductive Paste For Semiconductor Automatic Laboratory Equipment TIF 050-11P is a thermally conductivepaste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.7 https://www.ziitek.com.vn/sale-54774642-tif00n-15-16e-silicone-thermal-gap-pad-for-graphics-card-thermal-module.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl214328545-tif00n_15_16e_silicone_thermal_gap_pad_for_graphics_card_thermal_module.jpg https://www.ziitek.com.vn/photo/pl214328546-tif00n_15_16e_silicone_thermal_gap_pad_for_graphics_card_thermal_module.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF00N-15-16E Silicone thermal gap pad for Graphics Card Thermal Module TIF00N-15-16E Silicone thermal gap pad for Graphics Card Thermal Module Product descriptions TIF 100N-15-16E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB,which effecitly enhances https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.8 https://www.ziitek.com.vn/sale-51846681-tig780-25-high-thermal-conductivity-silicone-grease-for-cpu-heat-sinks.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202791453-tig780_25_high_thermal_conductivity_silicone_grease_for_cpu_heat_sinks.jpg https://www.ziitek.com.vn/photo/pl202791454-tig780_25_high_thermal_conductivity_silicone_grease_for_cpu_heat_sinks.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg TIG780-25 High thermal Conductivity Silicone grease For CPU Heat Sinks TIG780-25 High thermal Conductivity Silicone grease For CPU Heat Sinks The TIG 780-25 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issue. TIG 780-25 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is farsuperior to that offered by others. Features > Good thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.1 https://www.ziitek.com.vn/sale-51847097-tig780-30-thermal-conductivity-silicone-grease-thermal-paste-for-cpu-heat-sinks.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202792861-tig780_30_thermal_conductivity_silicone_grease_thermal_paste_for_cpu_heat_sinks.jpg https://www.ziitek.com.vn/photo/pl202792862-tig780_30_thermal_conductivity_silicone_grease_thermal_paste_for_cpu_heat_sinks.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg TIG780-30 Thermal Conductivity Silicone grease thermal Paste For CPU Heat Sinks TIG780-30 Thermal Conductivity Silicone grease thermal Paste For CPU Heat Sinks The TIG 780-30 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issue. TIG 780-30 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is farsuperior to that offered by others. Features > Good thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.3 https://www.ziitek.com.vn/sale-53869800-tig680-15ab-high-thermal-conductive-two-component-potting-silicone-for-industrial-control-transforme.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl208003184-tig680_15ab_high_thermal_conductive_two_component_potting_silicone_for_industrial_control_transformer.jpg https://www.ziitek.com.vn/photo/pl208003183-tig680_15ab_high_thermal_conductive_two_component_potting_silicone_for_industrial_control_transformer.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg TIG680-15AB High Thermal Conductive Two Component Potting Silicone For Industrial Control Transformer TIG 680-15AB High Thermal Conductive Two Component Potting Silicone For Industrial Control Transformer Products description TIG 680-15AB is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable, long working time and fire resistance. lt is especially suitable for capacitor, smal electronic equipment sealing. Its flexible, elastic characteristics enable it to provide cushioning for the materials it is coated with. The lower viscosity https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.1 https://www.ziitek.com.vn/sale-52173216-tig780-52-hot-sale-5-2w-high-quality-thermal-grease-cpu-gpu-graphics-card-conductivity-transistor-th.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl203731242-tig780_52_hot_sale_5_2w_high_quality_thermal_grease_cpu_gpu_graphics_card_conductivity_transistor_thermal_silicone_paste.jpg https://www.ziitek.com.vn/photo/pl203731243-tig780_52_hot_sale_5_2w_high_quality_thermal_grease_cpu_gpu_graphics_card_conductivity_transistor_thermal_silicone_paste.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg TIG780-52 Hot Sale 5.2W High Quality Thermal Grease Cpu Gpu Graphics Card Conductivity Transistor Thermal Silicone Paste TIG780-52 Hot Sale 5.2W High Quality Thermal Grease Cpu Gpu Graphics Card Conductivity Transistor Thermal Silicone Paste The TIG 780-52 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issue. TIG 780-52 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is farsuperior to that https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.9 https://www.ziitek.com.vn/sale-52027786-tig780-56-thermal-grease-cpu-thermal-paste-low-thermal-resistance-environmentally-friendly-silicon-p.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl203196005-tig780_56_thermal_grease_cpu_thermal_paste_low_thermal_resistance_environmentally_friendly_silicon_paste.jpg https://www.ziitek.com.vn/photo/pl203196007-tig780_56_thermal_grease_cpu_thermal_paste_low_thermal_resistance_environmentally_friendly_silicon_paste.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg TIG780-56 Thermal grease CPU thermal paste low thermal resistance environmentally friendly silicon paste TIG780-56 Thermal grease CPU thermal paste low thermal resistance environmentally friendly silicon paste The TIG 780-56 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issue. TIG 780-56 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is farsuperior to that offered by others. https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.8 https://www.ziitek.com.vn/sale-54274046-good-thermal-conductivity-thermal-grease-thermal-paste-for-electronic-components-al-server.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl210513938-good_thermal_conductivity_thermal_grease_thermal_paste_for_electronic_components_al_server.jpg https://www.ziitek.com.vn/photo/pl210514034-good_thermal_conductivity_thermal_grease_thermal_paste_for_electronic_components_al_server.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-electronics-fast-423907.jpg Good Thermal Conductivity Thermal Grease Thermal Paste For Electronic Components Al Server Good Thermal Conductivity Thermal Grease Thermal Paste For Electronic Components Al Server TIG 780-50HP Series is an environmentally friendly silicone based thermal paste designed to efficiently solve overheating problems in electronic devices and improve long-term reliability, TIG 780-50HP is a paste like material that can fully wet the surfaces of electronic components and heat sinks. It acts to fill the gaps between electronic components and heat sinks, eliminate air, and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/b6b804b2077d44f006b83c5e0d7ea6c4/playlist.m3u8 10 2026-03-06T10:27:35+08:00 4 4.7 https://www.ziitek.com.vn/sale-51806287-tig780-12-high-thermal-conductivity-silicone-heat-transfer-grease.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202721880-tig780_12_high_thermal_conductivity_silicone_heat_transfer_grease.jpg https://www.ziitek.com.vn/photo/pl202722119-tig780_12_high_thermal_conductivity_silicone_heat_transfer_grease.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-powerhouse-grease-423905.jpg TIG780-12 High Thermal Conductivity Silicone Heat Transfer Grease TIG780-12 High Thermal Conductivity Silicone Heat Transfer Grease The TIG 780-12 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issue. TIG 780-12 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is farsuperior to that offered by others. Features > Good thermal conductivity > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/fd98a5bd87b4f4f194fe20927f889f84/playlist.m3u8 15 2026-03-06T10:26:29+08:00 4 4.7 https://www.ziitek.com.vn/sale-53695449-tif100-20-05u-thermal-conductive-pad-thermal-insulation-silicone-pad-thermal-gap-pad-for-cpu-led-pcb.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl207347129-tif100_20_05u_thermal_conductive_pad_thermal_insulation_silicone_pad_thermal_gap_pad_for_cpu_led_pcb_gpu_ssd.jpg https://www.ziitek.com.vn/photo/pl207347130-tif100_20_05u_thermal_conductive_pad_thermal_insulation_silicone_pad_thermal_gap_pad_for_cpu_led_pcb_gpu_ssd.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-20-05U Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB /GPU/SSD TIF100-20-05U Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB /GPU/SSD Product descriptions TlFTM100-20-05U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.1 https://www.ziitek.com.vn/sale-53139528-tif600-silicone-thermal-conductive-gap-filler-pad-sheet-for-heat-sink-cooling.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205259027-tif600_silicone_thermal_conductive_gap_filler_pad_sheet_for_heat_sink_cooling.jpg https://www.ziitek.com.vn/photo/pl205259028-tif600_silicone_thermal_conductive_gap_filler_pad_sheet_for_heat_sink_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF600 Silicone Thermal Conductive Gap Filler Pad Sheet For Heat Sink Cooling TIF600 Silicone Thermal Conductive Gap Filler Pad Sheet For Heat Sink Cooling Product descriptions TlF600 Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 4.7W/mK > Naturally tacky needing https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.1 https://www.ziitek.com.vn/sale-53102363-tif200-08-04u-ul-recognized-cpu-display-card-thermal-gap-filler-pad-heat-sink-thermal-pad.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205106654-tif200_08_04u_ul_recognized_cpu_display_card_thermal_gap_filler_pad_heat_sink_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205106655-tif200_08_04u_ul_recognized_cpu_display_card_thermal_gap_filler_pad_heat_sink_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad Product descriptions TlFTM200-08-04U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 0.8W/mK > Moldability https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.3 https://www.ziitek.com.vn/sale-53337545-tif100-20-12s-ltd-thermal-pad-thermal-conductive-pad-customized-silicon-thermal-insulation-sheet-the.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205980755-tif100_20_12s_ltd_thermal_pad_thermal_conductive_pad_customized_silicon_thermal_insulation_sheet_thermal_pads_for_cpu.jpg https://www.ziitek.com.vn/photo/pl205980754-tif100_20_12s_ltd_thermal_pad_thermal_conductive_pad_customized_silicon_thermal_insulation_sheet_thermal_pads_for_cpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-20-12S LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU TIF100-20-12S LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU Product descriptions TlFTM100-20-12S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.6 https://www.ziitek.com.vn/sale-53221052-1-5w-m-k-blue-color-tif100-05u-thermal-pad-silicone-heating-pad-for-cpu-gpu.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205610607-1_5w_m_k_blue_color_tif100_05u_thermal_pad_silicone_heating_pad_for_cpu_gpu.jpg https://www.ziitek.com.vn/photo/pl205610608-1_5w_m_k_blue_color_tif100_05u_thermal_pad_silicone_heating_pad_for_cpu_gpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg 1.5W/M.K Blue Color TIF100-05U Thermal Pad Silicone Heating Pad For CPU GPU 1.5W/M.K Blue Color TIF100-05U Thermal Pad Silicone Heating Pad For CPU GPU Product descriptions TlFTM100-05U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.9 https://www.ziitek.com.vn/sale-53501847-tif500s-free-sample-heat-transfer-thermal-silicone-pad-for-led-cpu-gpu-mos-laptop.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl206578046-tif500s_free_sample_heat_transfer_thermal_silicone_pad_for_led_cpu_gpu_mos_laptop.jpg https://www.ziitek.com.vn/photo/pl206578047-tif500s_free_sample_heat_transfer_thermal_silicone_pad_for_led_cpu_gpu_mos_laptop.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF500S Free Sample Heat Transfer Thermal Silicone Pad For LED CPU GPU MOS Laptop TIF500S Free Sample Heat Transfer Thermal Silicone Pad For LED CPU GPU MOS Laptop Product descriptions TIFTM500S series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive > Moldability for complex parts > Soft and compressib https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.9 https://www.ziitek.com.vn/sale-53193787-tif500-30-05u-lithium-ion-battery-pack-thermal-pads-thermal-interface-materials.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205523914-tif500_30_05u_lithium_ion_battery_pack_thermal_pads_thermal_interface_materials.jpg https://www.ziitek.com.vn/photo/pl205523915-tif500_30_05u_lithium_ion_battery_pack_thermal_pads_thermal_interface_materials.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF500-30-05U Lithium-Ion Battery Pack Thermal Pads Thermal Interface Materials TIF500-30-05U Lithium-Ion Battery Pack Thermal Pads Thermal Interface Materials Product descriptions TlFTM500-30-05U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.9 https://www.ziitek.com.vn/sale-53220875-tif100-05es-thermal-conductive-sheet-soft-silicone-thermal-pad-thermal-insulator-silicone-pad-therma.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205610198-tif100_05es_thermal_conductive_sheet_soft_silicone_thermal_pad_thermal_insulator_silicone_pad_thermal_pad_silicon.jpg https://www.ziitek.com.vn/photo/pl205610197-tif100_05es_thermal_conductive_sheet_soft_silicone_thermal_pad_thermal_insulator_silicone_pad_thermal_pad_silicon.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-05ES Thermal Conductive Sheet Soft Silicone Thermal Pad Thermal Insulator Silicone Pad Thermal Pad Silicon Thermal Conductive Sheet Soft Silicone Thermal Pad Thermal Insulator Silicone Pad Thermal Pad Silicon Product descriptions TlFTM100-05ES Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive. They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. Its smooth, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.5 https://www.ziitek.com.vn/sale-53307009-tif100-05uf-thermal-pad-1-5w-the-thermal-conductivity-for-cpu-thermal-silicone-pads-thermal-pads.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl205881729-tif100_05uf_thermal_pad_1_5w_the_thermal_conductivity_for_cpu_thermal_silicone_pads_thermal_pads.jpg https://www.ziitek.com.vn/photo/pl205881730-tif100_05uf_thermal_pad_1_5w_the_thermal_conductivity_for_cpu_thermal_silicone_pads_thermal_pads.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-05UF Thermal Pad 1.5W The Thermal Conductivity For CPU Thermal Silicone Pads Thermal Pads TIF100-05UF Thermal Pad 1.5W The Thermal Conductivity For CPU Thermal Silicone Pads Thermal Pads Product descriptions TlFTM100-05UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.2 https://www.ziitek.com.vn/sale-51825638-tif100-12-05es-factory-custom-size-termal-pad-1-2w-led-heat-sink-cooling-pad.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202717932-tif100_12_05es_factory_custom_size_termal_pad_1_2w_led_heat_sink_cooling_pad.jpg https://www.ziitek.com.vn/photo/pl202717933-tif100_12_05es_factory_custom_size_termal_pad_1_2w_led_heat_sink_cooling_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-12-05ES Factory Custom Size Termal Pad 1.2W LED Heat Sink Cooling Pad TIF100-12-05ES Factory Custom Size Termal Pad 1.2W LED Heat Sink Cooling Pad The TIF 100-12-05ES Series thermally conductive interface materials are gapfillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.5 https://www.ziitek.com.vn/sale-51826368-tif100-12-05us-premium-performance-thermal-pads-1-2w-laptop-silicone-thermal-pads.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202721203-tif100_12_05us_premium_performance_thermal_pads_1_2w_laptop_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/pl202721202-tif100_12_05us_premium_performance_thermal_pads_1_2w_laptop_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads TIF 100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads The TIF 100-12-05US Series thermally conductive interface materials are gapfillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.7 https://www.ziitek.com.vn/sale-52054554-tif100-05s-heat-transfer-silicone-pad-thermal-pads-gap-filling-materials-gpu-desktop-notebook.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl203281276-tif100_05s_heat_transfer_silicone_pad_thermal_pads_gap_filling_materials_gpu_desktop_notebook.jpg https://www.ziitek.com.vn/photo/pl203281275-tif100_05s_heat_transfer_silicone_pad_thermal_pads_gap_filling_materials_gpu_desktop_notebook.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook TIF 100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook Product descriptions TlF 100-05S series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity > Naturally https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.4 https://www.ziitek.com.vn/sale-54310307-low-compression-stress-tif500-30-05u-thermal-gap-pad-materials-for-new-energy-vehicle-power-systems.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl210876316-low_compression_stress_tif500_30_05u_thermal_gap_pad_materials_for_new_energy_vehicle_power_systems.jpg https://www.ziitek.com.vn/photo/pl210876315-low_compression_stress_tif500_30_05u_thermal_gap_pad_materials_for_new_energy_vehicle_power_systems.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg Low Compression Stress TIF500-30-05U Thermal GAP PAD Materials For New Energy Vehicle Power Systems Low Compression Stress TIF500-30-05U Thermal GAP PAD Materials For New Energy Vehicle Power Systems Product descriptions TIF 500-30-05U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.2 https://www.ziitek.com.vn/sale-54300476-high-performance-silicone-gap-pads-ultra-soft-thermal-pad-for-electronic-components-5g-aerospace-ai.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl210821808-high_performance_silicone_gap_pads_ultra_soft_thermal_pad_for_electronic_components_5g_aerospace_ai.jpg https://www.ziitek.com.vn/photo/pl210821807-high_performance_silicone_gap_pads_ultra_soft_thermal_pad_for_electronic_components_5g_aerospace_ai.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI TIF100-30-23S High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI Product descriptions TIF 100-30-23S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.4 https://www.ziitek.com.vn/sale-51877173-tif100-60-16s-manufature-silicone-thermal-pad-thermal-sheet-for-mainboard-mother-board.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202920925-tif100_60_16s_manufature_silicone_thermal_pad_thermal_sheet_for_mainboard_mother_board.jpg https://www.ziitek.com.vn/photo/pl202920924-tif100_60_16s_manufature_silicone_thermal_pad_thermal_sheet_for_mainboard_mother_board.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-60-16S Manufature Silicone Thermal Pad Thermal Sheet For Mainboard/Mother Board Manufature Silicone Thermal Pad Thermal Sheet For Mainboard/Mother Board Product descriptions TlF 100-60-16S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.9 https://www.ziitek.com.vn/sale-52064095-ultra-soft-tif100-12u-silicone-thermal-gap-filler-thermal-pad-thermal-sheet-for-unmanned-drone.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl203311227-ultra_soft_tif100_12u_silicone_thermal_gap_filler_thermal_pad_thermal_sheet_for_unmanned_drone.jpg https://www.ziitek.com.vn/photo/pl203311226-ultra_soft_tif100_12u_silicone_thermal_gap_filler_thermal_pad_thermal_sheet_for_unmanned_drone.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg Ultra Soft TIF100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Ultra Soft TIF 100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Product descriptions TlF 100-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.3 https://www.ziitek.com.vn/sale-54165704-tif100-32-05u-ultra-soft-thermal-silicone-pad-3-2w-high-conductivity-gap-filler-for-ai-servers-gpu-c.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl209376485-tif100_32_05u_ultra_soft_thermal_silicone_pad_3_2w_high_conductivity_gap_filler_for_ai_servers_gpu_cooling_inverter.jpg https://www.ziitek.com.vn/photo/pl209376484-tif100_32_05u_ultra_soft_thermal_silicone_pad_3_2w_high_conductivity_gap_filler_for_ai_servers_gpu_cooling_inverter.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter The TIF 100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.1 https://www.ziitek.com.vn/sale-53921273-tif100-30-05u-thermal-pad-3-0w-mk-0-25mm-5-0mm-thickness-thermal-silicone-conductive-pads-for-automo.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl208207807-tif100_30_05u_thermal_pad_3_0w_mk_0_25mm_5_0mm_thickness_thermal_silicone_conductive_pads_for_automotive_engine_control_units.jpg https://www.ziitek.com.vn/photo/pl208207808-tif100_30_05u_thermal_pad_3_0w_mk_0_25mm_5_0mm_thickness_thermal_silicone_conductive_pads_for_automotive_engine_control_units.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-30-05U Thermal Pad 3.0W/Mk 0.25mm-5.0mm Thickness Thermal Silicone Conductive Pads For Automotive Engine Control Units TIF100-30-05U Thermal Pad 3.0W/Mk 0.25mm-5.0mm Thickness Thermal Silicone Conductive Pads For Automotive Engine Control Units Product descriptions TlF 100-30-05U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.6 https://www.ziitek.com.vn/sale-51877151-tif100-40-12s-thermal-pad-thermal-sheet-for-heat-sink-colling.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl202920794-tif100_40_12s_thermal_pad_thermal_sheet_for_heat_sink_colling.jpg https://www.ziitek.com.vn/photo/pl202920793-tif100_40_12s_thermal_pad_thermal_sheet_for_heat_sink_colling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-40-12S Thermal Pad Thermal Sheet For Heat Sink Colling TIF 100-40-12S Thermal Pad Thermal Sheet For Heat Sink Colling Product descriptions TlF 100-40-12S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.5 https://www.ziitek.com.vn/sale-52064774-ultra-soft-tif100-12u-silicone-thermal-gap-filler-thermal-pad-thermal-sheet-for-unmanned-drone.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl203318981-ultra_soft_tif100_12u_silicone_thermal_gap_filler_thermal_pad_thermal_sheet_for_unmanned_drone.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg Ultra Soft TIF100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Ultra Soft TIF 100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Product descriptions TlF 100-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.3 https://www.ziitek.com.vn/sale-52064815-3w-low-cost-tif100-30-05s-silicone-gap-filler-thermal-conductive-pad-for-unmanned-aerial-vehicle-uav.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl203312977-3w_low_cost_tif100_30_05s_silicone_gap_filler_thermal_conductive_pad_for_unmanned_aerial_vehicle_uav.jpg https://www.ziitek.com.vn/photo/pl203312978-3w_low_cost_tif100_30_05s_silicone_gap_filler_thermal_conductive_pad_for_unmanned_aerial_vehicle_uav.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg 3W Low Cost TIF100-30-05S Silicone Gap Filler Thermal Conductive Pad For Unmanned Aerial Vehicle(UAV) 3W Low Cost Silicone Gap Filler Thermal Conductive Pad For Unmanned Aerial Vehicle(UAV) Product descriptions TlF 100-30-05S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low stress https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.9 https://www.ziitek.com.vn/sale-54049331-tif100-30-05us-thermal-management-materials-premium-soft-thermally-conductive-gap-filler-pads-for-le.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl208763122-tif100_30_05us_thermal_management_materials_premium_soft_thermally_conductive_gap_filler_pads_for_led_flesible_strip_led_bar.jpg https://www.ziitek.com.vn/photo/pl208763123-tif100_30_05us_thermal_management_materials_premium_soft_thermally_conductive_gap_filler_pads_for_led_flesible_strip_led_bar.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-30-05US Thermal Management Materials Premium Soft Thermally Conductive Gap Filler Pads For LED Flesible Strip LED Bar TIF100-30-05US Thermal Management Materials Premium Soft Thermally Conductive Gap Filler Pads For LED Flesible Strip LED Bar Ziitek TIF 100-30-05US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features: > Good thermal conductive: 3.0W/mK > Moldability for complex parts > Soft https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.8 https://www.ziitek.com.vn/sale-53141104-tif500bs-efficient-silicone-thermal-pad-mobile-phone-thermal-pad-thermal-gap-filler.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl213947829-tif500bs_efficient_silicone_thermal_pad_mobile_phone_thermal_pad_thermal_gap_filler.jpg https://www.ziitek.com.vn/photo/pl213947840-tif500bs_efficient_silicone_thermal_pad_mobile_phone_thermal_pad_thermal_gap_filler.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF500BS Efficient Silicone Thermal-Pad Mobile Phone Thermal Pad Thermal Gap Filler TIF 500BS Efficient Silicone Thermal-Pad Mobile Phone Thermal Pad Thermal Gap Filler Product descriptions TIF 500BS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.8 https://www.ziitek.com.vn/sale-53796390-tif100-30-05e-high-temperature-resistant-heatsink-cooling-gap-filler-pad-thermal-conductive-silicone.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl207713369-tif100_30_05e_high_temperature_resistant_heatsink_cooling_gap_filler_pad_thermal_conductive_silicone_pad_for_cpu_gpu_ram.jpg https://www.ziitek.com.vn/photo/pl207713368-tif100_30_05e_high_temperature_resistant_heatsink_cooling_gap_filler_pad_thermal_conductive_silicone_pad_for_cpu_gpu_ram.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram The TIF 100-30-05E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.9 https://www.ziitek.com.vn/sale-52823960-tif100-50-05s-flexible-thermal-gap-filler-pad-for-battery-and-heat-sink-solutions.html 0.8 weekly 2026-03-06 https://www.ziitek.com.vn/photo/pl204676710-tif100_50_05s_flexible_thermal_gap_filler_pad_for_battery_and_heat_sink_solutions.jpg https://www.ziitek.com.vn/photo/pl204676711-tif100_50_05s_flexible_thermal_gap_filler_pad_for_battery_and_heat_sink_solutions.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-ai-servers-fast-423901.jpg TIF100-50-05S Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions TIF100-50-05S Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions Product descriptions TlF 100-50-05S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 5.0W/mK > Moldability for https://www.ziitek.com.vn/vodcdn/videos/encoder/1202603/59414e05fdf58c25176510786efa847d/playlist.m3u8 6 2026-03-06T10:22:56+08:00 4 4.7 https://www.ziitek.com.vn/sale-54766597-tif100-40-11e-good-insulation-performance-ultra-soft-thermally-conductive-gap-filler-pads-for-ai-pro.html 0.8 weekly 2026-03-05 https://www.ziitek.com.vn/photo/pl214201482-tif100_40_11e_good_insulation_performance_ultra_soft_thermally_conductive_gap_filler_pads_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl214201483-tif100_40_11e_good_insulation_performance_ultra_soft_thermally_conductive_gap_filler_pads_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-40-11E Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers Product descriptions TIF 100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-53086836-tif090-11-high-thermal-conductive-9-0w-thermal-condauctive-gel-for-heat-sink.html 0.8 weekly 2026-03-04 https://www.ziitek.com.vn/photo/pl205056953-tif090_11_high_thermal_conductive_9_0w_thermal_condauctive_gel_for_heat_sink.jpg https://www.ziitek.com.vn/photo/pl205056963-tif090_11_high_thermal_conductive_9_0w_thermal_condauctive_gel_for_heat_sink.jpg https://www.ziitek.com.vn/sale-54758817-z-foam800-10sc-high-temperature-resistance-shock-resistance-silicone-foaming-material-for-electric-v.html 0.8 weekly 2026-03-04 https://www.ziitek.com.vn/photo/pl214032492-z_foam800_10sc_high_temperature_resistance_shock_resistance_silicone_foaming_material_for_electric_vehicle.jpg https://www.ziitek.com.vn/photo/pl214032491-z_foam800_10sc_high_temperature_resistance_shock_resistance_silicone_foaming_material_for_electric_vehicle.jpg https://www.ziitek.com.vn/sale-54753918-tif700nu-good-insulation-performance-ultra-soft-6-5w-thermally-gap-pad-for-ai-server-computer-cpu-gp.html 0.8 weekly 2026-03-03 https://www.ziitek.com.vn/photo/pl213980332-tif700nu_good_insulation_performance_ultra_soft_6_5w_thermally_gap_pad_for_ai_server_computer_cpu_gpu_cooling.jpg https://www.ziitek.com.vn/photo/pl213980333-tif700nu_good_insulation_performance_ultra_soft_6_5w_thermally_gap_pad_for_ai_server_computer_cpu_gpu_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700NU Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling TIF 700NU Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling Product descriptions TIF 700NU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-53738860-tif700nes-thermal-conductive-silica-sheet-thermal-gap-filler-pad-for-telecommunication-equipment.html 0.8 weekly 2026-03-03 https://www.ziitek.com.vn/photo/pl207513933-tif700nes_thermal_conductive_silica_sheet_thermal_gap_filler_pad_for_telecommunication_equipment.jpg https://www.ziitek.com.vn/photo/pl207513934-tif700nes_thermal_conductive_silica_sheet_thermal_gap_filler_pad_for_telecommunication_equipment.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700NES Thermal Conductive Silica Sheet Thermal Gap Filler Pad For Telecommunication Equipment TIF 700NES Thermal Conductive Silica Sheet Thermal Gap Filler Pad For Telecommunication Equipment Product descriptions TIF 700NES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-53501687-tif500us-high-temperature-resistant-thermal-insulated-gap-pad-gpu-laptop-thermal-silicone-pad.html 0.8 weekly 2026-03-03 https://www.ziitek.com.vn/photo/pl206578433-tif500us_high_temperature_resistant_thermal_insulated_gap_pad_gpu_laptop_thermal_silicone_pad.jpg https://www.ziitek.com.vn/photo/pl206578432-tif500us_high_temperature_resistant_thermal_insulated_gap_pad_gpu_laptop_thermal_silicone_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/led-overheating-get-cooling-406267.jpg TIF500US High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad TIF500 US High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad Product descriptions TIF 500US series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/9779a10c0ef416b67d619cb89417964e/playlist.m3u8 11 2026-01-14T10:23:10+08:00 6 4.8 https://www.ziitek.com.vn/sale-52181373-tif500-20-01u-thermally-conductive-gap-filler-pads-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203757453-tif500_20_01u_thermally_conductive_gap_filler_pads_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl203757454-tif500_20_01u_thermally_conductive_gap_filler_pads_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF500-20-01U Thermally Conductive Gap Filler Pads Thermal Pad TIF500-20-01U Thermally Conductive Gap Filler Pads Thermal Pad Product descriptions TlF500-20-01U series thermally conductive interface materials are applied tofill the air gaps between the heating elements and the heat dissipation fins or themetal base.Their flexibility and elasticity make them suited to coat very unevensurfaces. Heat can transmit to the metal housing or dissipation plate from theheating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.6 https://www.ziitek.com.vn/sale-53220124-tif100-01f-thermally-conductive-gap-filler-pads-black-thermal-pad-for-laptop.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205607589-tif100_01f_thermally_conductive_gap_filler_pads_black_thermal_pad_for_laptop.jpg https://www.ziitek.com.vn/photo/pl205607590-tif100_01f_thermally_conductive_gap_filler_pads_black_thermal_pad_for_laptop.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-01F Thermally Conductive Gap Filler Pads black thermal pad for Laptop TIF100-01F Thermally Conductive Gap Filler Pads black thermal pad for Laptop Product descriptions TlFTM100-01F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.7 https://www.ziitek.com.vn/sale-53151696-tif100-01s-cpu-conductive-silicon-thermal-pad-products-custom.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205305074-tif100_01s_cpu_conductive_silicon_thermal_pad_products_custom.jpg https://www.ziitek.com.vn/photo/pl205305073-tif100_01s_cpu_conductive_silicon_thermal_pad_products_custom.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-01S CPU Conductive Silicon Thermal Pad Products Custom TIFTM100-01S CPU Conductive Silicon Thermal Pad Products Custom Product descriptions TlFTM100-01S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.4 https://www.ziitek.com.vn/sale-51811169-tif100-50-11f-ultra-soft-silicone-thermal-pad-on-pc-cooling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202665584-tif100_50_11f_ultra_soft_silicone_thermal_pad_on_pc_cooling.jpg https://www.ziitek.com.vn/photo/pl202665583-tif100_50_11f_ultra_soft_silicone_thermal_pad_on_pc_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling Ziitek TIF 100-50-11F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good thermal conductive: 5.0W/mK > Good thermal conductivity > Naturally tacky needing no https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.2 https://www.ziitek.com.vn/sale-53933003-tif100-30-01e-ul-certificated-soft-heat-sinking-thermal-conductive-pad-3-0w-mk-silicone-thermal-pad-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208263293-tif100_30_01e_ul_certificated_soft_heat_sinking_thermal_conductive_pad_3_0w_mk_silicone_thermal_pad_for_mainboard_mother_board.jpg https://www.ziitek.com.vn/photo/pl208263291-tif100_30_01e_ul_certificated_soft_heat_sinking_thermal_conductive_pad_3_0w_mk_silicone_thermal_pad_for_mainboard_mother_board.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-30-01E UL Certificated Soft Heat Sinking Thermal Conductive Pad 3.0W/MK Silicone Thermal Pad For Mainboard/Mother Board TIF 100-30-01E UL Certificated Soft Heat Sinking Thermal Conductive Pad 3.0W/MK Silicone Thermal Pad for Mainboard/Mother Board Product descriptions TlF 100-30-01E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.1 https://www.ziitek.com.vn/sale-52104502-factory-supply-tif100-01e-ultra-soft-1-5w-customized-die-cutting-heatsink-thermal-pad-for-laptop-led.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203465753-factory_supply_tif100_01e_ultra_soft_1_5w_customized_die_cutting_heatsink_thermal_pad_for_laptop_led_cpu_gpu.jpg https://www.ziitek.com.vn/photo/pl203465754-factory_supply_tif100_01e_ultra_soft_1_5w_customized_die_cutting_heatsink_thermal_pad_for_laptop_led_cpu_gpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg Factory Supply TIF100-01E Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu Factory Supply TIF 100-01E Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu Product descriptions TlF 100-01E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.4 https://www.ziitek.com.vn/sale-53201938-tif100-01es-self-adhesive-thermal-gap-pad-6-0w-m-k-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205549093-tif100_01es_self_adhesive_thermal_gap_pad_6_0w_m_k_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205549092-tif100_01es_self_adhesive_thermal_gap_pad_6_0w_m_k_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-01ES Self-Adhesive Thermal Gap Pad 6.0W/M K Silicone Thermal Pad TIF100-01ES Self-Adhesive Thermal Gap Pad 6.0W/M K Silicone Thermal Pad Product descriptions TlFTM100-07S Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductivity 1.5W/mK > Naturally tacky needing no furtheradhesive https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.6 https://www.ziitek.com.vn/sale-51793728-tif100-11s-silicone-thermal-pad-thermal-gap-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202721647-tif100_11s_silicone_thermal_pad_thermal_gap_pad.jpg https://www.ziitek.com.vn/photo/pl202721646-tif100_11s_silicone_thermal_pad_thermal_gap_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-11S Silicone Thermal Pad Thermal Gap Pad TIF 100-11S Silicone thermal pad thermal gap pad The TIF 100-11S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.4 https://www.ziitek.com.vn/sale-53991150-tif100-50-11u-ultra-soft-thermal-gap-pad-materials-5-0w-thickness-0-25mm-to5-0mm-thermal-gap-filler-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl212790937-tif100_50_11u_ultra_soft_thermal_gap_pad_materials_5_0w_thickness_0_25mm_to5_0mm_thermal_gap_filler_pad_for_car_battery.jpg https://www.ziitek.com.vn/photo/pl212790938-tif100_50_11u_ultra_soft_thermal_gap_pad_materials_5_0w_thickness_0_25mm_to5_0mm_thermal_gap_filler_pad_for_car_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-50-11U Ultra Soft Thermal GAP PAD Materials 5.0W Thickness 0.25mm To5.0mm Thermal Gap Filler Pad For Car Battery Ultra Soft Thermal GAP PAD Materials 5.0W Thickness 0.25mm To5.0mm Thermal Gap Filler Pad For Car Battery Product descriptions TIF 100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.2 https://www.ziitek.com.vn/sale-54293889-tif100-15-11s-d-low-density-thermal-pad-for-high-speed-networks-and-ai-servers.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl210724460-tif100_15_11s_d_low_density_thermal_pad_for_high_speed_networks_and_ai_servers.jpg https://www.ziitek.com.vn/photo/pl210724459-tif100_15_11s_d_low_density_thermal_pad_for_high_speed_networks_and_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-15-11S-D Low Density Thermal Pad For High Speed Networks And AI Servers TIF100-15-11S-D Low Density Thermal Pad For High Speed Networks And AI Servers Product descriptions TIS 100-15-11S-D Series is an innovative low-density thermal pad that offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and outstanding ease of use, delivering effective heat transfer and basicphysical protection for a wide range of electronic components while achieving lightweight performance. Features: > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.4 https://www.ziitek.com.vn/sale-54281430-tis300-45-thermally-conductive-and-electrically-conductive-silicone-thermal-pad-for-improvement-of-w.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl210559407-tis300_45_thermally_conductive_and_electrically_conductive_silicone_thermal_pad_for_improvement_of_wifi_signal.jpg https://www.ziitek.com.vn/photo/pl210559408-tis300_45_thermally_conductive_and_electrically_conductive_silicone_thermal_pad_for_improvement_of_wifi_signal.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIS300-45 Thermally Conductive And Electrically Conductive Silicone Thermal Pad For Improvement Of Wifi Signal TIS 300-45 Thermally Conductive And Electrically Conductive Silicone Thermal Pad For Improvement Of Wifi Signal Product descriptions TIS 300-45 Series is a nickel/graphite-filled conductive and thermally conductive silicone sheet, specially developed for thermal management and electromagnetic interference suppression of 3C electronic products, high-frequency signal devices, and precision electromagnetic components. It features excellent thermal conductivity and surface https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.8 https://www.ziitek.com.vn/sale-54227725-tif700pu-cpu-high-thermal-conductivity-die-cut-silicon-thermal-pad-for-ai-processors-ai-servers.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl210065840-tif700pu_cpu_high_thermal_conductivity_die_cut_silicon_thermal_pad_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl210065836-tif700pu_cpu_high_thermal_conductivity_die_cut_silicon_thermal_pad_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF700PU CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers TIF700PU CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers The TIF 700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect flling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance,and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.8 https://www.ziitek.com.vn/sale-54712766-tif500-30-11e-3-0w-silicone-thermal-gap-pad-for-network-communication-products.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl213611090-tif500_30_11e_3_0w_silicone_thermal_gap_pad_for_network_communication_products.jpg https://www.ziitek.com.vn/photo/pl213611089-tif500_30_11e_3_0w_silicone_thermal_gap_pad_for_network_communication_products.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF500-30-11E 3.0W Silicone Thermal Gap Pad For Network Communication Products TIF500-30-11E 3.0W Silicone Thermal Gap Pad For Network Communication Products Product descriptions TIF 500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.1 https://www.ziitek.com.vn/sale-51827541-tif100-01u-ideal-gap-filler-1-5w-laptop-silicone-thermal-pads.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202724678-tif100_01u_ideal_gap_filler_1_5w_laptop_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/pl202724674-tif100_01u_ideal_gap_filler_1_5w_laptop_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-01U Ideal Gap Filler 1.5W Laptop Silicone Thermal Pads TIF 100-01U Ideal Gap Filler 1.5W Laptop Silicone Thermal Pads Product descriptions TlF 100-01U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.5 https://www.ziitek.com.vn/sale-51839489-tif100-01us-factory-termal-pad-1-5w-thermal-conductive-cooling-pad-for-led-laptop-gpu-cooling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202768192-tif100_01us_factory_termal_pad_1_5w_thermal_conductive_cooling_pad_for_led_laptop_gpu_cooling.jpg https://www.ziitek.com.vn/photo/pl202768191-tif100_01us_factory_termal_pad_1_5w_thermal_conductive_cooling_pad_for_led_laptop_gpu_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-overheating-thermal-pad-solution-421291.jpg TIF100-01US Factory Termal Pad 1.5w Thermal Conductive Cooling Pad For Led Laptop GPU Cooling TIF100-01US Factory Termal Pad 1.5w Thermal Conductive Cooling Pad For Led Laptop GPU Cooling Product descriptions TlF 100-01US series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/7744f312adcb06cfcad5554d26ca7b4e/playlist.m3u8 11 2026-02-27T15:07:04+08:00 4 4.1 https://www.ziitek.com.vn/sale-53482186-tif100-18-06e-high-thermal-conductivity-gap-filler-pad-for-automotive-silicon-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206502322-tif100_18_06e_high_thermal_conductivity_gap_filler_pad_for_automotive_silicon_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl206502323-tif100_18_06e_high_thermal_conductivity_gap_filler_pad_for_automotive_silicon_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100-18-06E High Thermal Conductivity Gap Filler Pad For Automotive Silicon Thermal Pad TIF100-18-06E High Thermal Conductivity Gap Filler Pad For Automotive Silicon Thermal Pad Product descriptions TlF100-18-06E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.8 https://www.ziitek.com.vn/sale-53088993-tif100-06u-performance-thermal-pad-with-highly-efficient-thermal-conductivity-for-cpu-cooling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205066567-tif100_06u_performance_thermal_pad_with_highly_efficient_thermal_conductivity_for_cpu_cooling.jpg https://www.ziitek.com.vn/photo/pl205066568-tif100_06u_performance_thermal_pad_with_highly_efficient_thermal_conductivity_for_cpu_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling Product descriptions TlF100-06U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.1 https://www.ziitek.com.vn/sale-53152999-tif100-06s-1-5w-thickness-0-5mm-thermal-conductive-pad-gap-filling-materials-silicone-thermal-pad-fo.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205311433-tif100_06s_1_5w_thickness_0_5mm_thermal_conductive_pad_gap_filling_materials_silicone_thermal_pad_for_led_cpu_laptop.jpg https://www.ziitek.com.vn/photo/pl205311434-tif100_06s_1_5w_thickness_0_5mm_thermal_conductive_pad_gap_filling_materials_silicone_thermal_pad_for_led_cpu_laptop.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100-06S 1.5W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop 1.5W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop Product descriptions TlFTM100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1 https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.8 https://www.ziitek.com.vn/sale-52170717-tif100-02f-notebook-thermal-gap-filler-1-5w-silicon-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203721094-tif100_02f_notebook_thermal_gap_filler_1_5w_silicon_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl203721095-tif100_02f_notebook_thermal_gap_filler_1_5w_silicon_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100-02F Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad Product descriptions TlF 100-02F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and compressible for low stress https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.2 https://www.ziitek.com.vn/sale-53182664-tif200-15-01f-a1-customized-self-adhesive-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205486869-tif200_15_01f_a1_customized_self_adhesive_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205486870-tif200_15_01f_a1_customized_self_adhesive_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF200-15-01F-A1 Customized Self Adhesive Silicone Thermal Pad TIF200-15-01F-A1 Customized Self Adhesive Silicone Thermal Pad Product descriptions TlF200-15-01F-A1 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.4 https://www.ziitek.com.vn/sale-54491712-tif100-3030-06-thermal-conductivity-of-3-0w-mk-ultra-soft-thermal-pad-for-5g-aerospace-ai-aiot-and-a.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl212350210-tif100_3030_06_thermal_conductivity_of_3_0w_mk_ultra_soft_thermal_pad_for_5g_aerospace_ai_aiot_and_automotive.jpg https://www.ziitek.com.vn/photo/pl212350211-tif100_3030_06_thermal_conductivity_of_3_0w_mk_ultra_soft_thermal_pad_for_5g_aerospace_ai_aiot_and_automotive.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100 3030-06 Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive TIF100 3030-06 Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive Product descriptions The TIF 100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low-stress perfect fit. It is suitable for addressing issues in high https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.6 https://www.ziitek.com.vn/sale-54591640-tif100l-4035-06-low-volatility-thermal-pad-100x100mm-highly-efficient-thermal-conductivity-4-0w-mk-h.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl213394456-tif100l_4035_06_low_volatility_thermal_pad_100x100mm_highly_efficient_thermal_conductivity_4_0w_mk_heat_resistant_high_temperature.jpg https://www.ziitek.com.vn/photo/pl213394455-tif100l_4035_06_low_volatility_thermal_pad_100x100mm_highly_efficient_thermal_conductivity_4_0w_mk_heat_resistant_high_temperature.jpg https://www.ziitek.com.vn/photo/ziitek/video/cooling-pad-solves-heat-421286.jpg TIF100L 4035-06 Low Volatility Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0W/MK Heat Resistant High Temperature Low Volatility Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0W/MK Heat Resistant High Temperature Product descriptions The TIF 100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity, it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneveninterfaces effectively,achieving ultra-low thermal resistance and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/bcc7e1af59012d6fa1c4646f68bc71f1/playlist.m3u8 8 2026-02-27T15:02:56+08:00 4 4.2 https://www.ziitek.com.vn/sale-53089056-tif100-11u-high-performance-thermal-pad-silicone-cooling-pad-with-dual-self-adhesive-films-for-pc-la.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205066933-tif100_11u_high_performance_thermal_pad_silicone_cooling_pad_with_dual_self_adhesive_films_for_pc_laptop.jpg https://www.ziitek.com.vn/photo/pl205066934-tif100_11u_high_performance_thermal_pad_silicone_cooling_pad_with_dual_self_adhesive_films_for_pc_laptop.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-11U High Performance Thermal Pad Silicone Cooling Pad With Dual Self-Adhesive Films For PC Laptop TIF100-11U High Performance Thermal Pad Silicone Cooling Pad With Dual Self-Adhesive Films For PC Laptop Product descriptions TlF100-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TlF100-11U is an electrically isolating material, which allows its use in applications requiring isolation between https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53095141-tif100-6520-11-high-performance-6-5w-heatsink-thermal-pads-gpu-cpu-cooling-conductive-silicone-therm.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205084911-tif100_6520_11_high_performance_6_5w_heatsink_thermal_pads_gpu_cpu_cooling_conductive_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205084912-tif100_6520_11_high_performance_6_5w_heatsink_thermal_pads_gpu_cpu_cooling_conductive_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100 6520-11 High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad TIF100 6520-11 High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad Product descriptions TIF 100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-53210581-tif700pes-good-thermal-conductive-silicone-thermal-pad-for-laptop-heatsink-cpu-gpu-ssd-ic-led-cooler.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205577795-tif700pes_good_thermal_conductive_silicone_thermal_pad_for_laptop_heatsink_cpu_gpu_ssd_ic_led_cooler.jpg https://www.ziitek.com.vn/photo/pl205577794-tif700pes_good_thermal_conductive_silicone_thermal_pad_for_laptop_heatsink_cpu_gpu_ssd_ic_led_cooler.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700PES Good Thermal Conductive Silicone Thermal Pad For Laptop Heatsink CPU GPU SSD IC LED Cooler TIF700PES Good Thermal Conductive Silicone Thermal Pad For Laptop Heatsink CPU GPU SSD IC LED Cooler Product descriptions TIF 700PES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53189298-tif700pus-custom-7-5w-mk-3mm-2mm-1-5mm-silicone-conductive-soft-gpu-cpu-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205508635-tif700pus_custom_7_5w_mk_3mm_2mm_1_5mm_silicone_conductive_soft_gpu_cpu_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205508636-tif700pus_custom_7_5w_mk_3mm_2mm_1_5mm_silicone_conductive_soft_gpu_cpu_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad Product descriptions TIF 700PUS Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-53152168-tif100-02s-termal-pad-1-5w-1mm-2mm-3mm-5mm-cooling-silicone-thermal-conductive-pads-for-cpu-led-lapt.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205307173-tif100_02s_termal_pad_1_5w_1mm_2mm_3mm_5mm_cooling_silicone_thermal_conductive_pads_for_cpu_led_laptop.jpg https://www.ziitek.com.vn/photo/pl205307172-tif100_02s_termal_pad_1_5w_1mm_2mm_3mm_5mm_cooling_silicone_thermal_conductive_pads_for_cpu_led_laptop.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-02S Termal Pad 1.5W 1mm 2mm 3mm 5mm Cooling Silicone Thermal Conductive Pads For CPU LED Laptop TIFTM100-02S Termal Pad 1.5W 1mm 2mm 3mm 5mm Cooling Silicone Thermal Conductive Pads For CPU LED Laptop Product descriptions TlFTM100-02S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-02S is an electrically isolating material, which allows its use in applications requiring isolation https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53189642-tif700u-thermal-interface-material-10-0w-thermal-silicone-pad-for-new-energy-vehicle-batteries-pcb.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205509484-tif700u_thermal_interface_material_10_0w_thermal_silicone_pad_for_new_energy_vehicle_batteries_pcb.jpg https://www.ziitek.com.vn/photo/pl205509483-tif700u_thermal_interface_material_10_0w_thermal_silicone_pad_for_new_energy_vehicle_batteries_pcb.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700U Thermal Interface Material 10.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB TIF700U Thermal Interface Material 10.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB Product descriptions TIF 700U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-53193996-tif500-30-11u-ultra-soft-3-0w-m-k-silicone-thermal-pad-for-led.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205525043-tif500_30_11u_ultra_soft_3_0w_m_k_silicone_thermal_pad_for_led.jpg https://www.ziitek.com.vn/photo/pl205525042-tif500_30_11u_ultra_soft_3_0w_m_k_silicone_thermal_pad_for_led.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-30-11U Ultra Soft 3.0W/M-K Silicone Thermal Pad for LED TIF500-30-11U Ultra Soft 3.0W/M-K Silicone Thermal Pad for LED and Lithium-Ion Battery Pack Product descriptions TlFTM500-30-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-53174423-tif100-10055-62-thermally-conductive-heat-transfer-pad-silicone-sheet-thermal-pad-for-automotive-ele.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205455011-tif100_10055_62_thermally_conductive_heat_transfer_pad_silicone_sheet_thermal_pad_for_automotive_electronics.jpg https://www.ziitek.com.vn/photo/pl205455012-tif100_10055_62_thermally_conductive_heat_transfer_pad_silicone_sheet_thermal_pad_for_automotive_electronics.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics Product descriptions TIF 100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-53174195-tif100-6045-62-high-strength-6-0w-electrically-insulating-pad-thermal-pad-for-electronic-components-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205454182-tif100_6045_62_high_strength_6_0w_electrically_insulating_pad_thermal_pad_for_electronic_components_heat_sinks.jpg https://www.ziitek.com.vn/photo/pl205454183-tif100_6045_62_high_strength_6_0w_electrically_insulating_pad_thermal_pad_for_electronic_components_heat_sinks.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100 6045-62 High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks Product descriptions TIF 100 6545-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-53193999-tif500-30-11us-ultra-soft-3-0w-m-k-silicone-thermal-pad-for-led-power-supply.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205525043-tif500_30_11us_ultra_soft_3_0w_m_k_silicone_thermal_pad_for_led_power_supply.jpg https://www.ziitek.com.vn/photo/pl205525042-tif500_30_11us_ultra_soft_3_0w_m_k_silicone_thermal_pad_for_led_power_supply.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-30-11US Ultra Soft 3.0W/M-K Silicone Thermal Pad for LED Power Supply TIF500-30-11US Ultra Soft 3.0W/M-K Silicone Thermal Pad for LED and Lithium-Ion Battery Pack Product descriptions TlFTM500-30-11US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TlFTM500-30-11US is an electrically isolating material, which allows its use in applications requiring isolation between https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-53202387-tif100-11u-heat-resistant-1-5w-silicone-thermal-pads-for-laptop-heatsink-cpu-gpu-ssd-ic-led-cooler.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205550330-tif100_11u_heat_resistant_1_5w_silicone_thermal_pads_for_laptop_heatsink_cpu_gpu_ssd_ic_led_cooler.jpg https://www.ziitek.com.vn/photo/pl205550329-tif100_11u_heat_resistant_1_5w_silicone_thermal_pads_for_laptop_heatsink_cpu_gpu_ssd_ic_led_cooler.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-11U Heat Resistant 1.5W Silicone Thermal Pads For Laptop Heatsink CPU GPU SSD IC LED Cooler TIF100-11U Heat Resistant 1.5W Silicone Thermal Pads For Laptop Heatsink CPU GPU SSD IC LED Cooler Product descriptions TlFTM100-11U Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53210273-tif700l-hm-low-volatility-flexible-silicone-thermal-pad-for-battery-and-heat-sink-solutions.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205576232-tif700l_hm_low_volatility_flexible_silicone_thermal_pad_for_battery_and_heat_sink_solutions.jpg https://www.ziitek.com.vn/photo/pl205576233-tif700l_hm_low_volatility_flexible_silicone_thermal_pad_for_battery_and_heat_sink_solutions.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700L-HM Low Volatility Flexible Silicone Thermal Pad For Battery And Heat Sink Solutions TIF700L-HM Low Volatility Flexible Silicone Thermal Pad For Battery And Heat Sink Solutions Product descriptions TIF 700L-HM Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-53151193-tif800qe-thermal-conductive-silicone-pad-for-notebook-memory-motherboard-display-insulated-cpu-compu.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205303369-tif800qe_thermal_conductive_silicone_pad_for_notebook_memory_motherboard_display_insulated_cpu_computer_accessories.jpg https://www.ziitek.com.vn/photo/pl205303370-tif800qe_thermal_conductive_silicone_pad_for_notebook_memory_motherboard_display_insulated_cpu_computer_accessories.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800QE Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU Computer Accessories Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU Computer Accessories Product descriptions TIF 800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53210092-tif700hm-flexible-thermal-gap-filler-pad-for-battery-and-heat-sink-solutions.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205575505-tif700hm_flexible_thermal_gap_filler_pad_for_battery_and_heat_sink_solutions.jpg https://www.ziitek.com.vn/photo/pl205575506-tif700hm_flexible_thermal_gap_filler_pad_for_battery_and_heat_sink_solutions.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700HM Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions TIF700HM Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions Product descriptions TIF 700HM Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-53182319-tif200-15-12s-customized-self-adhesive-thermal-gap-filler-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205485458-tif200_15_12s_customized_self_adhesive_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/pl205485459-tif200_15_12s_customized_self_adhesive_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF200-15-12S Customized Self Adhesive Thermal Gap Filler Pad TIF200-15-12S Customized Self Adhesive Thermal Gap Filler Pad Product descriptions TlF200-15-12S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-53318446-tif100-10s-thermal-pad-silicone-thermal-insulator-gap-filling-pad-effect-heat-dissipation-conductive.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205917905-tif100_10s_thermal_pad_silicone_thermal_insulator_gap_filling_pad_effect_heat_dissipation_conductive_pad.jpg https://www.ziitek.com.vn/photo/pl205917906-tif100_10s_thermal_pad_silicone_thermal_insulator_gap_filling_pad_effect_heat_dissipation_conductive_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad Product descriptions TlFTM100-10S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-53457303-tif100-35-11uf-high-conductive-3-5w-thermal-silicone-pad-cooling-gap-filler-for-cpu-premium-insulati.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206442239-tif100_35_11uf_high_conductive_3_5w_thermal_silicone_pad_cooling_gap_filler_for_cpu_premium_insulation_element.jpg https://www.ziitek.com.vn/photo/pl206442240-tif100_35_11uf_high_conductive_3_5w_thermal_silicone_pad_cooling_gap_filler_for_cpu_premium_insulation_element.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Product descriptions TIF 100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-53236699-tif100-12055-62-custom-12w-mk-silicone-conductive-soft-gpu-cpu-termal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205658375-tif100_12055_62_custom_12w_mk_silicone_conductive_soft_gpu_cpu_termal_pad.jpg https://www.ziitek.com.vn/photo/pl205658376-tif100_12055_62_custom_12w_mk_silicone_conductive_soft_gpu_cpu_termal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100 12055-62 Custom 12W/Mk Silicone Conductive Soft Gpu Cpu Termal Pad TIF 100 12055-62 Custom 12W/Mk Silicone Conductive Soft Gpu Cpu Termal Pad Product descriptions TIF 12055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-53214120-tif500-50-11u-high-temperature-resistant-flame-retardant-insulation-5-0w-mk-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205590437-tif500_50_11u_high_temperature_resistant_flame_retardant_insulation_5_0w_mk_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205590438-tif500_50_11u_high_temperature_resistant_flame_retardant_insulation_5_0w_mk_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-50-11U High-Temperature Resistant Flame-Retardant Insulation 5.0W/MK Silicone Thermal Pad TIF500-50-11U High-Temperature Resistant Flame-Retardant Insulation 5.0W/MK Silicone Thermal Pad Product descriptions TlF500-50-11U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF500-50-11U is an electrically isolating material, which allows its use in applications requiring isolation https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-53217115-tif500-75-11us-high-thermal-conductivity-resistant-flame-retardant-insulation-7-5w-mk-silicone-therm.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205598650-tif500_75_11us_high_thermal_conductivity_resistant_flame_retardant_insulation_7_5w_mk_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205598651-tif500_75_11us_high_thermal_conductivity_resistant_flame_retardant_insulation_7_5w_mk_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-75-11US High Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad High Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad Product descriptions TlF500-75-11U Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 7.5W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53326410-tif100-uf-high-quality-thickness-0-5mm-to-5-0mm-insulated-thermal-pad-computer-cooling-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205943226-tif100_uf_high_quality_thickness_0_5mm_to_5_0mm_insulated_thermal_pad_computer_cooling_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205943225-tif100_uf_high_quality_thickness_0_5mm_to_5_0mm_insulated_thermal_pad_computer_cooling_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-UF High Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Pad TIF100-UF High Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Pad Product descriptions TlFTM100-10UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-10UF is an electrically isolating material, which allows its use in applications requiring isolation between heat https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53334905-tif100-10f-premium-soft-silicone-thermal-pad-insulated-thermal-pad-computer-cooling-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205971334-tif100_10f_premium_soft_silicone_thermal_pad_insulated_thermal_pad_computer_cooling_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205971333-tif100_10f_premium_soft_silicone_thermal_pad_insulated_thermal_pad_computer_cooling_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-10F Premium Soft Silicone Thermal Pad Insulated Thermal Pad Computer Cooling Thermal Pad TIF100-10F Premium Soft Silicone Thermal Pad Insulated Thermal Pad Computer Cooling Thermal Pad Product descriptions TlFTM100-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 1.5W/mK > Moldabilit https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-53349415-tif500-65-11es-battery-thermal-pad-8-5w-mkw-thermal-insulator-silicone-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206020218-tif500_65_11es_battery_thermal_pad_8_5w_mkw_thermal_insulator_silicone_pad.jpg https://www.ziitek.com.vn/photo/pl206020217-tif500_65_11es_battery_thermal_pad_8_5w_mkw_thermal_insulator_silicone_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-65-11ES Battery Thermal Pad 8.5W/MKW Thermal Insulator Silicone Pad TIF500-65-11ES Battery Thermal Pad 8.5W/MKW Thermal Insulator Silicone Pad Product descriptions TIFTM500-65-11ES series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive > Moldability for complex https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-53217877-tif500-30-11es-rohs-compliant-resistant-flame-retardant-insulation-3-0w-mk-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205600887-tif500_30_11es_rohs_compliant_resistant_flame_retardant_insulation_3_0w_mk_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl205600885-tif500_30_11es_rohs_compliant_resistant_flame_retardant_insulation_3_0w_mk_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-30-11ES RoHS Compliant Resistant Flame-Retardant Insulation 3.0W/MK Silicone Thermal Pad TIF500-30-11ES RoHS Compliant Resistant Flame-Retardant Insulation 3.0W/MK Silicone Thermal Pad Product descriptions TlF500-30-11ES Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts > Broad range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53362029-tif100n-40-10f-silicone-thermal-conductive-pad-cooling-led-cpu-gpu-heat-conductivity-interface-mater.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206065674-tif100n_40_10f_silicone_thermal_conductive_pad_cooling_led_cpu_gpu_heat_conductivity_interface_materials.jpg https://www.ziitek.com.vn/photo/pl206065670-tif100n_40_10f_silicone_thermal_conductive_pad_cooling_led_cpu_gpu_heat_conductivity_interface_materials.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials Product descriptions TlFTM100N-40-10F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-53401408-tif700hu-thermal-silicone-insulation-cooling-gap-filler-pad-thermal-transfer-gap-filler-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206225008-tif700hu_thermal_silicone_insulation_cooling_gap_filler_pad_thermal_transfer_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/pl206225009-tif700hu_thermal_silicone_insulation_cooling_gap_filler_pad_thermal_transfer_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad Product descriptions TIFTM700HU Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-53414096-tif700hp-silicone-thermal-pad-7-5w-m-k-insulation-conductive-pads-thermal-gap-pad-for-unmanned-aeria.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206278253-tif700hp_silicone_thermal_pad_7_5w_m_k_insulation_conductive_pads_thermal_gap_pad_for_unmanned_aerial_vehicle_uav.jpg https://www.ziitek.com.vn/photo/pl206278254-tif700hp_silicone_thermal_pad_7_5w_m_k_insulation_conductive_pads_thermal_gap_pad_for_unmanned_aerial_vehicle_uav.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV) Product descriptions TIFTM700HP Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-51794132-tif100-20-11us-ultra-soft-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202617900-tif100_20_11us_ultra_soft_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl202617899-tif100_20_11us_ultra_soft_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-11US Ultra-soft silicone thermal pad TIF100-20-11US Ultra-soft silicone thermal pad The TIF 100-20-11US is an extremely soft gap filling material rated at a thermal conductivity of 2.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF 100-20-11US is highly conformal to rough or irregular surfaces, allowing https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-51794758-tif100-25-02f-ultra-soft-silicone-thermal-conductive-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202619290-tif100_25_02f_ultra_soft_silicone_thermal_conductive_pad.jpg https://www.ziitek.com.vn/photo/pl202619291-tif100_25_02f_ultra_soft_silicone_thermal_conductive_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-25-02F Ultra-Soft Silicone Thermal Conductive Pad TIF100-25-02F Ultra-Soft Silicone Thermal Conductive Pad The TIF 100-25-02F is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF 100-25-02F is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. Features: https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-51795165-tif100-30-02-ultra-soft-silicone-thermal-conductive-gap-filler-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202620956-tif100_30_02_ultra_soft_silicone_thermal_conductive_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/pl202620957-tif100_30_02_ultra_soft_silicone_thermal_conductive_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap filler Pad The TIF 100-30-02 is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF 100-30-02 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-52833047-tif800qe-high-thermal-conductivity-gray-silicone-thermal-pad-for-electronic-heat-dissipation.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204716150-tif800qe_high_thermal_conductivity_gray_silicone_thermal_pad_for_electronic_heat_dissipation.jpg https://www.ziitek.com.vn/photo/pl204716149-tif800qe_high_thermal_conductivity_gray_silicone_thermal_pad_for_electronic_heat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800QE High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat Dissipation TIF800QE High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat Dissipation Product descriptions The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-53482558-tif100-18-11u-silicone-thermally-conductive-gap-filler-pad-thermally-conductive-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206503213-tif100_18_11u_silicone_thermally_conductive_gap_filler_pad_thermally_conductive_silicone_thermal_pad_for_high_temperature_application.jpg https://www.ziitek.com.vn/photo/pl206503219-tif100_18_11u_silicone_thermally_conductive_gap_filler_pad_thermally_conductive_silicone_thermal_pad_for_high_temperature_application.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application Product descriptions TlF100-18-11U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-51811292-tif100-60-11f-thermal-silicone-pad-for-heat-sink-cooling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202666762-tif100_60_11f_thermal_silicone_pad_for_heat_sink_cooling.jpg https://www.ziitek.com.vn/photo/pl202666763-tif100_60_11f_thermal_silicone_pad_for_heat_sink_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling Ziitek TIF 100-60-11F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features: > Good thermal conductive: 6.0W/mK > Good thermal conductivity > Naturally tacky needing no furtheradhesive coating > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-53493526-6-5w-high-quality-tif500-65-11u-factory-wholesale-customized-thermal-pad-for-led-cpu-gpu-mos.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206548685-6_5w_high_quality_tif500_65_11u_factory_wholesale_customized_thermal_pad_for_led_cpu_gpu_mos.jpg https://www.ziitek.com.vn/photo/pl206548683-6_5w_high_quality_tif500_65_11u_factory_wholesale_customized_thermal_pad_for_led_cpu_gpu_mos.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg 6.5W High Quality TIF500-65-11U Factory Wholesale Customized Thermal Pad For LED CPU GPU MOS 6.5W High Quality TIF500-65-11U Factory Wholesale Customized Thermal Pad For LED CPU GPU MOS Product descriptions TIFTM500-65-11U series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive > Moldability for complex parts > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53600073-thermal-conductive-silicone-pad-aluminum-battery-5g-phone-tif500-65-11us-thermal-interface-material-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206934329-thermal_conductive_silicone_pad_aluminum_battery_5g_phone_tif500_65_11us_thermal_interface_material_thermal_conductive_gap_filler.jpg https://www.ziitek.com.vn/photo/pl206934330-thermal_conductive_silicone_pad_aluminum_battery_5g_phone_tif500_65_11us_thermal_interface_material_thermal_conductive_gap_filler.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler Product descriptions TIFTM500-65-11US series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53638264-tif100-20-11s-electric-thermal-pad-silica-gap-filler-thermal-pad-with-durable-silicone-material.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl207101965-tif100_20_11s_electric_thermal_pad_silica_gap_filler_thermal_pad_with_durable_silicone_material.jpg https://www.ziitek.com.vn/photo/pl207101964-tif100_20_11s_electric_thermal_pad_silica_gap_filler_thermal_pad_with_durable_silicone_material.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-11S Electric Thermal Pad Silica Gap Filler Thermal Pad With Durable Silicone Material TIF100-20-11S Electric Thermal Pad Silica Gap Filler Thermal Pad With Durable Silicone Material Product descriptions TlF100-20-11S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53646545-tif100-30-11s-high-voltage-silicone-thermal-pad-insulation-material-heat-conduction-sheet-for-effici.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl207138567-tif100_30_11s_high_voltage_silicone_thermal_pad_insulation_material_heat_conduction_sheet_for_efficient_heat_transfer.jpg https://www.ziitek.com.vn/photo/pl207138569-tif100_30_11s_high_voltage_silicone_thermal_pad_insulation_material_heat_conduction_sheet_for_efficient_heat_transfer.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11S High-Voltage Silicone Thermal Pad Insulation Material Heat Conduction Sheet For Efficient Heat Transfer TIF100-30-11S High-Voltage Silicone Thermal Pad Insulation Material Heat Conduction Sheet For Efficient Heat Transfer Product descriptions TlF100-30-11S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-53692196-tif100-20-10uf-thermally-conductive-gap-filler-pads-for-mobile-phone-smart-watch-earphone-mobile-pow.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl207335310-tif100_20_10uf_thermally_conductive_gap_filler_pads_for_mobile_phone_smart_watch_earphone_mobile_power_supply.jpg https://www.ziitek.com.vn/photo/pl207335311-tif100_20_10uf_thermally_conductive_gap_filler_pads_for_mobile_phone_smart_watch_earphone_mobile_power_supply.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-10UF Thermally Conductive Gap Filler Pads For Mobile Phone, Smart Watch, Earphone, Mobile Power Supply TIF100-20-10UF Thermally Conductive Gap Filler Pads For Mobile Phone, Smart Watch, Earphone, Mobile Power Supply Product descriptions TlFTM100-20-10UF Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-52833469-tif800q-high-thermal-conductive-5-0w-silicone-thermal-sheet-thermal-pad-for-automotive-efficient-hea.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl206466107-tif800q_high_thermal_conductive_5_0w_silicone_thermal_sheet_thermal_pad_for_automotive_efficient_heat_dissipation.jpg https://www.ziitek.com.vn/photo/pl206466106-tif800q_high_thermal_conductive_5_0w_silicone_thermal_sheet_thermal_pad_for_automotive_efficient_heat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800Q High Thermal Conductive 5.0W Silicone Thermal Sheet Thermal Pad For Automotive Efficient Heat Dissipation High Thermal Conductive 13W Silicone Thermal Sheet Thermal Pad For Automotive Efficient Heat Dissipation Product descriptions TlF800Q is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive:13.0W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-52130657-tif200-01u-hot-selling-thermal-conductive-silicon-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203567143-tif200_01u_hot_selling_thermal_conductive_silicon_pad.jpg https://www.ziitek.com.vn/photo/pl203567144-tif200_01u_hot_selling_thermal_conductive_silicon_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF200-01U Hot Selling Thermal Conductive Silicon Pad TIF 200-01U Hot Selling Thermal Conductive Silicon Pad Product descriptions TlF 200-01U use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and compressible for low stress https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-53837655-tif800es-high-strength-high-temperature-resistant-thermal-pads-silicon-insulator-pad-for-battery.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl207882148-tif800es_high_strength_high_temperature_resistant_thermal_pads_silicon_insulator_pad_for_battery.jpg https://www.ziitek.com.vn/photo/pl207882147-tif800es_high_strength_high_temperature_resistant_thermal_pads_silicon_insulator_pad_for_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800ES High-Strength High-Temperature Resistant Thermal Pads Silicon Insulator Pad For Battery TIF 800ES High-Strength High-Temperature Resistant Thermal Pads Silicon Insulator Pad For Battery Product descriptions TlF 800ES Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive: 5.0W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53831403-tif100-20-10s-2-0w-thermal-conductivity-silicon-pad-silicon-insulation-pads-cooling-gap-filler-silic.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl207854585-tif100_20_10s_2_0w_thermal_conductivity_silicon_pad_silicon_insulation_pads_cooling_gap_filler_silicone_pads_for_gpu_cpu.jpg https://www.ziitek.com.vn/photo/pl207854587-tif100_20_10s_2_0w_thermal_conductivity_silicon_pad_silicon_insulation_pads_cooling_gap_filler_silicone_pads_for_gpu_cpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-10S 2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU 2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU Product descriptions TlF 100-20-10S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-51825741-tif112-12-10s-k1-factory-custom-size-termal-pad-1-2w-laptop-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202718361-tif112_12_10s_k1_factory_custom_size_termal_pad_1_2w_laptop_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl202718360-tif112_12_10s_k1_factory_custom_size_termal_pad_1_2w_laptop_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF112-12-10S-K1 Factory Custom Size Termal Pad 1.2W Laptop Silicone Thermal Pad TIF 112-12-10S-K1 Factory Custom Size Termal Pad 1.2W Laptop Silicone Thermal Pad The TIF 112-12-10S-K1 Series thermally conductive interface materials are gapfillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-51841871-tif300-efficient-thermal-conductivity-silicone-thermal-pads-for-electronics-cooling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202776524-tif300_efficient_thermal_conductivity_silicone_thermal_pads_for_electronics_cooling.jpg https://www.ziitek.com.vn/photo/pl202776525-tif300_efficient_thermal_conductivity_silicone_thermal_pads_for_electronics_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF300 Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling Product descriptions TlF 300 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-52055810-customized-tif100-18-11e-self-adhesive-high-heat-transfer-thermal-pad-for-laptops.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203294884-customized_tif100_18_11e_self_adhesive_high_heat_transfer_thermal_pad_for_laptops.jpg https://www.ziitek.com.vn/photo/pl203294886-customized_tif100_18_11e_self_adhesive_high_heat_transfer_thermal_pad_for_laptops.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg Customized TIF100-18-11E Self Adhesive High Heat Transfer Thermal Pad For Laptops Customized TIF 100-18-11E Self Adhesive High Heat Transfer Thermal Pad For Laptops Product descriptions TlF 100-18-11E series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity > Naturally tacky https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-51841840-tif100-02u-wholesale-silicone-thermal-conductive-pads-for-laptop-led-cooling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202776324-tif100_02u_wholesale_silicone_thermal_conductive_pads_for_laptop_led_cooling.jpg https://www.ziitek.com.vn/photo/pl202776323-tif100_02u_wholesale_silicone_thermal_conductive_pads_for_laptop_led_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-02U Wholesale Silicone Thermal Conductive Pads For Laptop LED Cooling TIF 100-02U Wholesale Silicone Thermal Conductive Pads For Laptop LED Cooling Product descriptions TlF 100-02U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-52084460-tif100-30-11f-sample-free-3-0-w-m-k-thermally-conductive-pad-for-led-tv-heat-dissipation.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203380362-tif100_30_11f_sample_free_3_0_w_m_k_thermally_conductive_pad_for_led_tv_heat_dissipation.jpg https://www.ziitek.com.vn/photo/pl203380363-tif100_30_11f_sample_free_3_0_w_m_k_thermally_conductive_pad_for_led_tv_heat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11F Sample Free 3.0 W/M.K Thermally Conductive Pad For LED/TV Heat Dissipation Sample Free 3.0 W/M.K Thermally Conductive Pad For LED/TV Heat Dissipation Product descriptions TlF 100-30-11F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-52109149-tif100-20-02s-high-thermal-conductive-pad-for-automotive-silicon-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203485443-tif100_20_02s_high_thermal_conductive_pad_for_automotive_silicon_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl203485444-tif100_20_02s_high_thermal_conductive_pad_for_automotive_silicon_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-02S High Thermal Conductive Pad For Automotive Silicon Thermal Pad TIF 100-20-02S High Thermal Conductive Pad For Automotive Silicon Thermal Pad Product descriptions TlF 100-20-02S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 2.0W/mK > Moldability for complex https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-52130582-tif100-20-10e-heatsink-thermal-pads-gpu-cpu-heatsink-cooling-conductive-silicone-thermal-pad-accesso.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203566296-tif100_20_10e_heatsink_thermal_pads_gpu_cpu_heatsink_cooling_conductive_silicone_thermal_pad_accessories_supplies.jpg https://www.ziitek.com.vn/photo/pl203566295-tif100_20_10e_heatsink_thermal_pads_gpu_cpu_heatsink_cooling_conductive_silicone_thermal_pad_accessories_supplies.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-20-10E Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies 2.0W/mK Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies Product descriptions TlF 100-20-10E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-52084153-tif100-30-11s-thermal-conductive-silicon-pad-for-mass-storage-devices.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203379724-tif100_30_11s_thermal_conductive_silicon_pad_for_mass_storage_devices.jpg https://www.ziitek.com.vn/photo/pl203379725-tif100_30_11s_thermal_conductive_silicon_pad_for_mass_storage_devices.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11S Thermal Conductive Silicon Pad For Mass storage devices Thermal Conductive Silicon Pad For Mass storage devices Product descriptions TlF 100-30-11S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52134193-tif500-50-11u-ultra-soft-5w-m-k-ceramic-filled-silicone-ic-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203580029-tif500_50_11u_ultra_soft_5w_m_k_ceramic_filled_silicone_ic_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl203580030-tif500_50_11u_ultra_soft_5w_m_k_ceramic_filled_silicone_ic_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-50-11U Ultra Soft 5W/M-K Ceramic Filled Silicone IC Thermal Pad TIF 500-50-11U Ultra Soft 5W/M-K Ceramic Filled Silicone IC Thermal Pad Product descriptions TlF 500-50-11U use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 5.0W/mK > Moldability for complex parts > Soft and compressible https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-51036979-tif100-10-02f-silicone-thermal-pad.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202721717-tif100_10_02f_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl202721718-tif100_10_02f_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-10-02F Silicone Thermal Pad TIF 100-10-02F Silicone Thermal Pad Product introduction The TIF 100-10-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-52139611-tif700hq-electric-insulation-silicone-thermal-pad-for-ev-battery.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203598246-tif700hq_electric_insulation_silicone_thermal_pad_for_ev_battery.jpg https://www.ziitek.com.vn/photo/pl203598247-tif700hq_electric_insulation_silicone_thermal_pad_for_ev_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700HQ Electric Insulation Silicone Thermal Pad For EV Battery TIF 700HQ Electric Insulation Silicone Thermal Pad For EV Battery Product descriptions TlF 700HQ is an extremely soft gap filling material rated at a thermal conductivity of 8.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF 700HQ is highly conformal to rough or irregular https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-52136160-tif700q-factory-price-hot-selling-thermal-conductive-silicon-pad-8w-mk-silicone-thermal-gap-filling.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203588105-tif700q_factory_price_hot_selling_thermal_conductive_silicon_pad_8w_mk_silicone_thermal_gap_filling.jpg https://www.ziitek.com.vn/photo/pl203588104-tif700q_factory_price_hot_selling_thermal_conductive_silicon_pad_8w_mk_silicone_thermal_gap_filling.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling TIF 700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling Product descriptions TlF 700Q is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-53862720-tif800us-5-0w-high-quality-factory-wholesale-customized-thermal-pad-thermal-gap-filler-insulation-sh.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl207971863-tif800us_5_0w_high_quality_factory_wholesale_customized_thermal_pad_thermal_gap_filler_insulation_sheet_silicone_pad_for_led_cpu_gpu_mos.jpg https://www.ziitek.com.vn/photo/pl207971872-tif800us_5_0w_high_quality_factory_wholesale_customized_thermal_pad_thermal_gap_filler_insulation_sheet_silicone_pad_for_led_cpu_gpu_mos.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800US 5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS TIF800US 5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS Product descriptions The TIF 800US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53891216-tif100-30-11es-high-strength-high-temperature-resistant-thermal-silicon-insulator-pad-thermal-pad-fo.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208083140-tif100_30_11es_high_strength_high_temperature_resistant_thermal_silicon_insulator_pad_thermal_pad_for_igbts.jpg https://www.ziitek.com.vn/photo/pl208083141-tif100_30_11es_high_strength_high_temperature_resistant_thermal_silicon_insulator_pad_thermal_pad_for_igbts.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11ES High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs TIF 100-30-11ES High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs Product descriptions TlF 100-30-11ES thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53904525-tif100-30-11u-highly-efficient-thermal-conductivity-1-2w-mk-silicone-thermal-pads-for-laptop-heat-in.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208134701-tif100_30_11u_highly_efficient_thermal_conductivity_1_2w_mk_silicone_thermal_pads_for_laptop_heat_insulation_materials.jpg https://www.ziitek.com.vn/photo/pl208134700-tif100_30_11u_highly_efficient_thermal_conductivity_1_2w_mk_silicone_thermal_pads_for_laptop_heat_insulation_materials.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11U Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials TIF100-30-11U Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials Product descriptions TlF 100-30-11U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-53916075-tif100-30-11f-3-0w-m-k-thermal-pads-silicone-cooling-pad-heat-resistance-with-self-adhesive-films-fo.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208187078-tif100_30_11f_3_0w_m_k_thermal_pads_silicone_cooling_pad_heat_resistance_with_self_adhesive_films_for_pc_laptop.jpg https://www.ziitek.com.vn/photo/pl208187076-tif100_30_11f_3_0w_m_k_thermal_pads_silicone_cooling_pad_heat_resistance_with_self_adhesive_films_for_pc_laptop.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11F 3.0W/M.K Thermal Pads Silicone Cooling Pad Heat Resistance With Self-Adhesive Films For PC Laptop TIF100-30-11F 3.0W/M.K Thermal Pads Silicone Cooling Pad Heat Resistance With Self-Adhesive Films For PC Laptop Product descriptions TlF 100-30-11F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-54016921-tif800qe-manufacturer-customized-thermal-conductive-silicon-pad-thermal-conductive-silicone-thermal-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208612198-tif800qe_manufacturer_customized_thermal_conductive_silicon_pad_thermal_conductive_silicone_thermal_heating_pad_for_insulation_and_buffering.jpg https://www.ziitek.com.vn/photo/pl208612199-tif800qe_manufacturer_customized_thermal_conductive_silicon_pad_thermal_conductive_silicone_thermal_heating_pad_for_insulation_and_buffering.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800QE Manufacturer Customized Thermal Conductive Silicon Pad Thermal Conductive Silicone Thermal Heating Pad For Insulation And Buffering Manufacturer Customized Thermal Conductive Silicon Pad Thermal Conductive Silicone Thermal Heating Pad For Insulation And Buffering Product descriptions Ziitek TlF 800QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF 800QE is an electrically isolating material, which allows its use in applications https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-52156443-tif500-50-10u-thermal-pad-2w-mk-silicon-thermal-gap-pad-filling-for-telecommunication-hardware.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203675664-tif500_50_10u_thermal_pad_2w_mk_silicon_thermal_gap_pad_filling_for_telecommunication_hardware.jpg https://www.ziitek.com.vn/photo/pl203675665-tif500_50_10u_thermal_pad_2w_mk_silicon_thermal_gap_pad_filling_for_telecommunication_hardware.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware TIF 500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware Product descriptions TlF 500-50-10U is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52149392-tif800-wholesale-5-0w-gray-silicone-thermal-pad-for-automotive-engine-control-units.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203644540-tif800_wholesale_5_0w_gray_silicone_thermal_pad_for_automotive_engine_control_units.jpg https://www.ziitek.com.vn/photo/pl203644541-tif800_wholesale_5_0w_gray_silicone_thermal_pad_for_automotive_engine_control_units.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800 Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units TIF 800 Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units Product descriptions TlF 800 is an extremely soft gap filling material rated at a thermal conductivity of 5.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF 800 is highly conformal to rough https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-52139838-4-0w-insulation-silicone-thermal-conductive-sheet-tif100-4010s-silicone-thermal-transfer-pad-for-bat.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203599082-4_0w_insulation_silicone_thermal_conductive_sheet_tif100_4010s_silicone_thermal_transfer_pad_for_battery_cpu.jpg https://www.ziitek.com.vn/photo/pl203599083-4_0w_insulation_silicone_thermal_conductive_sheet_tif100_4010s_silicone_thermal_transfer_pad_for_battery_cpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg 4.0W Insulation Silicone Thermal Conductive Sheet TIF100-4010S Silicone Thermal Transfer Pad For Battery CPU 4.0W Insulation Silicone Thermal Conductive Sheet TIF 100-4010S Silicone Thermal Transfer Pad For Battery CPU Product descriptions TlF 100-40-10S is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF 100-40-10S is an electrically isolating material, which allows its use in applications requiring https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53940477-tif100-30-11us-thermal-conductivity-1-5w-thickness-0-5-5-0mm-silicone-thermal-pad-insulation-thermal.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208308092-tif100_30_11us_thermal_conductivity_1_5w_thickness_0_5_5_0mm_silicone_thermal_pad_insulation_thermal_pad_for_game_machine.jpg https://www.ziitek.com.vn/photo/pl208308093-tif100_30_11us_thermal_conductivity_1_5w_thickness_0_5_5_0mm_silicone_thermal_pad_insulation_thermal_pad_for_game_machine.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine TIF 100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine Product descriptions TlF 100-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52169783-tif700z-heat-resistant-7w-mk-thermal-pads-for-laptop-heatsink-cpu-gpu-led-cooler.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203719440-tif700z_heat_resistant_7w_mk_thermal_pads_for_laptop_heatsink_cpu_gpu_led_cooler.jpg https://www.ziitek.com.vn/photo/pl203719439-tif700z_heat_resistant_7w_mk_thermal_pads_for_laptop_heatsink_cpu_gpu_led_cooler.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700Z Heat Resistant 7W/MK Thermal Pads For Laptop Heatsink CPU GPU LED Cooler TIF 700Z Heat Resistant 7W/MK Thermal Pads For Laptop Heatsink CPU GPU LED Cooler Product descriptions TlF 700Z is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-54202157-tif700m-thermal-pad-manufacturer-high-temperature-silicon-thermal-pad-for-ai-servers-ai-processors.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl209675838-tif700m_thermal_pad_manufacturer_high_temperature_silicon_thermal_pad_for_ai_servers_ai_processors.jpg https://www.ziitek.com.vn/photo/pl209675839-tif700m_thermal_pad_manufacturer_high_temperature_silicon_thermal_pad_for_ai_servers_ai_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700M Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors The TIF 700M Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-54208492-tif700pes-thermal-silicone-pad-7-5w-high-conductivity-heat-dissipation-sheet-for-ai-server.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl205971333-tif700pes_thermal_silicone_pad_7_5w_high_conductivity_heat_dissipation_sheet_for_ai_server.jpg https://www.ziitek.com.vn/photo/pl205917905-tif700pes_thermal_silicone_pad_7_5w_high_conductivity_heat_dissipation_sheet_for_ai_server.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700PES Thermal Silicone Pad 7.5W, High Conductivity Heat Dissipation Sheet For AI Server TIF700M Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors The TIF 700PES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air thermal resistance,and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-54241180-tif700pus-good-heat-dissipation-7-5w-silicone-thermal-pad-for-ai-processors-ai-servers.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl210186703-tif700pus_good_heat_dissipation_7_5w_silicone_thermal_pad_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl210186704-tif700pus_good_heat_dissipation_7_5w_silicone_thermal_pad_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700PUS Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers TIF700PUS Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers The TIF 700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-54050881-tif100-40-11s-custom-size-thermal-pad-1-15w-0-5mm-5-0mm-cooling-new-energy-vehicle-silicone-themals-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208768607-tif100_40_11s_custom_size_thermal_pad_1_15w_0_5mm_5_0mm_cooling_new_energy_vehicle_silicone_themals_conductive_pads.jpg https://www.ziitek.com.vn/photo/pl208768606-tif100_40_11s_custom_size_thermal_pad_1_15w_0_5mm_5_0mm_cooling_new_energy_vehicle_silicone_themals_conductive_pads.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-40-11S Custom Size Thermal Pad 1-15W 0.5mm~5.0mm Cooling New Energy Vehicle Silicone Themals Conductive Pads TIF100-40-11S Custom Size Thermal Pad 1-15W 0.5mm~5.0mm Cooling New Energy Vehicle Silicone Themals Conductive Pads Ziitek TIF 100-40-11S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good thermal conductive: 4.0W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-54320900-tif500-30-11u-ultra-soft-and-highly-compliant-thermally-conductive-gap-filler-pads-thermal-pads-for-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl210933838-tif500_30_11u_ultra_soft_and_highly_compliant_thermally_conductive_gap_filler_pads_thermal_pads_for_ai_processors.jpg https://www.ziitek.com.vn/photo/pl210933837-tif500_30_11u_ultra_soft_and_highly_compliant_thermally_conductive_gap_filler_pads_thermal_pads_for_ai_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-30-11U Ultra Soft And Highly Compliant Thermally Conductive Gap Filler Pads Thermal Pads For AI Processors TIF500-30-11U Ultra Soft And Highly Compliant Thermally Conductive Gap Filler Pads Thermal Pads For AI Processors Product descriptions TIF 500-30-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-54328159-tif500-30-11us-high-performance-3-0w-mk-silicone-thermal-pad-with-great-conductivity.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl210955697-tif500_30_11us_high_performance_3_0w_mk_silicone_thermal_pad_with_great_conductivity_insulation_for_cpu_gpu_ai_and_processors.jpg https://www.ziitek.com.vn/photo/pl210955696-tif500_30_11us_high_performance_3_0w_mk_silicone_thermal_pad_with_great_conductivity_insulation_for_cpu_gpu_ai_and_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-30-11US High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors TIF500-30-11US High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors Product descriptions TIF 500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-54351421-tif500-40-11u-silicone-thermal-pad-offering-anti-oxidation-high-insulation.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl211150547-tif500_40_11u_silicone_thermal_pad_offering_anti_oxidation_high_insulation_quick_heat_dissipation_for_ai_servers.jpg https://www.ziitek.com.vn/photo/pl211150548-tif500_40_11u_silicone_thermal_pad_offering_anti_oxidation_high_insulation_quick_heat_dissipation_for_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-40-11U Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers TIF500-40-11U Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers Product descriptions TIF 500-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-54355893-tif500-40-11us-high-temperature-silicone-sheet-heat-resistance-pad-thermally-silicone-pad-for-ai-pro.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl211212730-tif500_40_11us_high_temperature_silicone_sheet_heat_resistance_pad_thermally_silicone_pad_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl211212731-tif500_40_11us_high_temperature_silicone_sheet_heat_resistance_pad_thermally_silicone_pad_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-40-11US High Temperature Silicone Sheet Heat Resistance Pad Thermally Silicone Pad For AI Processors AI Servers High Temperature Silicone Sheet Heat Resistance Pad Thermally Silicone Pad For AI Processors AI Servers Product descriptions TIF 500-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52180527-tif700qe-silicone-8-0w-thermal-pad-for-cpu-gpu-for-various-strict-application-fields.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl203755210-tif700qe_silicone_8_0w_thermal_pad_for_cpu_gpu_for_various_strict_application_fields.jpg https://www.ziitek.com.vn/photo/pl203755211-tif700qe_silicone_8_0w_thermal_pad_for_cpu_gpu_for_various_strict_application_fields.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700QE Silicone 8.0W Thermal Pad For CPU GPU For Various Strict Application Fields TIF700QE Silicone 8.0W Thermal Pad For CPU GPU For Various Strict Application Fields Product descriptions TlF700QE is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-54081344-tif500-50-11es-electrically-isolating-multiple-thickness-factory-thermal-pad-pad-for-electric-produc.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208891255-tif500_50_11es_electrically_isolating_multiple_thickness_factory_thermal_pad_pad_for_electric_products.jpg https://www.ziitek.com.vn/photo/pl208891256-tif500_50_11es_electrically_isolating_multiple_thickness_factory_thermal_pad_pad_for_electric_products.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-50-11ES Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products TIF500-50-11ES Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products Product descriptions TlF 500-50-11ES is a thermal pad specifically designed to address the most demanding thermal challenges and highly sensitive mechanical stress environments. Combining exceptional thermal conductivity with near-fluid softness, it ensures perfect filing of contact interfaces even under ultra-low installation pressure, completely eliminating air thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-54147321-tif300us-new-energy-vehicle-power-systems-efficient-ultra-soft-3-0-w-mk-0-25mm-0-5mm-thickness-silic.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl209234471-tif300us_new_energy_vehicle_power_systems_efficient_ultra_soft_3_0_w_mk_0_25mm_0_5mm_thickness_silicone_heat_transfer_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl209234472-tif300us_new_energy_vehicle_power_systems_efficient_ultra_soft_3_0_w_mk_0_25mm_0_5mm_thickness_silicone_heat_transfer_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF300US New Energy Vehicle Power Systems Efficient Ultra-Soft 3.0 W/MK 0.25mm~0.5mm Thickness Silicone Heat Transfer Thermal Pad TIF300US New Energy Vehicle Power Systemsr Efficient Ultra-Soft 3.0 W/MK 0.25mm~0.5mm Thickness Silicone Heat Transfer Thermal Pad The TIF 300US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-54039198-tif100-30-02us-high-conductive-insulation-thermal-silicone-pad-cooling-gap-filler-for-semiconductor.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl208722245-tif100_30_02us_high_conductive_insulation_thermal_silicone_pad_cooling_gap_filler_for_semiconductor.jpg https://www.ziitek.com.vn/photo/pl208722244-tif100_30_02us_high_conductive_insulation_thermal_silicone_pad_cooling_gap_filler_for_semiconductor.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor Ziitek TIF 100-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features: > Good thermal conductive: 3.0W/mK > Moldability for complex parts > Soft and compressible for low https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-54426557-tif500-75-11us-good-insulation-performance-7-5w-heat-transfer-thermal-silicone-gel-pads-for-ai-serve.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl211715761-tif500_75_11us_good_insulation_performance_7_5w_heat_transfer_thermal_silicone_gel_pads_for_ai_servers_ai_processors.jpg https://www.ziitek.com.vn/photo/pl211715762-tif500_75_11us_good_insulation_performance_7_5w_heat_transfer_thermal_silicone_gel_pads_for_ai_servers_ai_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-75-11US Good Insulation Performance 7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors TIF500-75-11US Good Insulation Performance 7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors Product descriptions The TIF 500-75-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.2 https://www.ziitek.com.vn/sale-52637665-tif700rus-thermal-conductive-silicone-pad-for-lithium-battery-graphics-card-gpu.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204343094-tif700rus_thermal_conductive_silicone_pad_for_lithium_battery_graphics_card_gpu.jpg https://www.ziitek.com.vn/photo/pl204343093-tif700rus_thermal_conductive_silicone_pad_for_lithium_battery_graphics_card_gpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700RUS Thermal Conductive Silicone Pad For Lithium Battery Graphics Card GPU TIF700RUS Thermal Conductive Silicone Pad For Lithium Battery Graphics Card GPU Product descriptions TlF700HP thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 8.5W/mK > Outstanding thermal performance > High tack surface reduces contact https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-54455799-tif100-40-11u-high-performance-silicone-based-thermally-gap-pad-filler-for-ai-processors-ai-servers.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl212047225-tif100_40_11u_high_performance_silicone_based_thermally_gap_pad_filler_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl212047224-tif100_40_11u_high_performance_silicone_based_thermally_gap_pad_filler_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-40-11U High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads Product descriptions The TIF 100-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-52638334-tif700r-thermal-pad-gpu-cpu-heatsink-cooling-conductive-silicone.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204343751-tif700r_thermal_pad_gpu_cpu_heatsink_cooling_conductive_silicone.jpg https://www.ziitek.com.vn/photo/pl204343752-tif700r_thermal_pad_gpu_cpu_heatsink_cooling_conductive_silicone.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Product descriptions TlF 700R use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 8.5W/mK > Outstanding thermal performance > High tack surface reduces contact https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52571551-tif700hz-efficient-thermal-conductivity-7-5w-mk-silcione-thermal-pad-easy-to-apply-for-cpu.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204254512-tif700hz_efficient_thermal_conductivity_7_5w_mk_silcione_thermal_pad_easy_to_apply_for_cpu.jpg https://www.ziitek.com.vn/photo/pl204254513-tif700hz_efficient_thermal_conductivity_7_5w_mk_silcione_thermal_pad_easy_to_apply_for_cpu.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700HZ Efficient Thermal Conductivity 7.5W/MK Silcione Thermal Pad Easy To Apply For CPU TIF700HP Efficient Thermal Conductivity 7.5W/MK Silcione Thermal Pad Easy To Apply For CPU Product descriptions TlF700HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 7.5W/mK > Outstanding thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-52813373-tif100c-8045-11-high-performance-8-0w-thermal-gap-filler-pad-for-lndustrial-equipment.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204636356-tif100c_8045_11_high_performance_8_0w_thermal_gap_filler_pad_for_lndustrial_equipment.jpg https://www.ziitek.com.vn/photo/pl204636355-tif100c_8045_11_high_performance_8_0w_thermal_gap_filler_pad_for_lndustrial_equipment.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 8045-11 High-Performance 8.0W Thermal Gap Filler Pad For Lndustrial Equipment TIF100C 8045-11 High-Performance 8.0W Thermal Gap Filler Pad For Lndustrial Equipment Product descriptions TS-TIF 100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-52570386-tif700m-highly-efficient-thermal-conductivity-6-0-w-mk-heat-resistant-silicone-thermal-pads.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204251273-tif700m_highly_efficient_thermal_conductivity_6_0_w_mk_heat_resistant_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/pl204251272-tif700m_highly_efficient_thermal_conductivity_6_0_w_mk_heat_resistant_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads Product descriptions TlF 700M is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF700M is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.9 https://www.ziitek.com.vn/sale-54485451-tif100-2855-10-low-bleed-thermal-pad-thermal-gap-pad-materials-for-ai-processors-ai-servers.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl212305736-tif100_2855_10_low_bleed_thermal_pad_thermal_gap_pad_materials_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl212305735-tif100_2855_10_low_bleed_thermal_pad_thermal_gap_pad_materials_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100 2855-10 Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers TIF100 2855-10 Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers Product descriptions The TIF 100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components. Features > Good thermal https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-52663363-tif700res-thermally-conductive-gap-filler-pads-for-medical-devices.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204393225-tif700res_thermally_conductive_gap_filler_pads_for_medical_devices.jpg https://www.ziitek.com.vn/photo/pl204393227-tif700res_thermally_conductive_gap_filler_pads_for_medical_devices.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700RES Thermally Conductive Gap Filler Pads For Medical Devices TIF700RES Thermally Conductive Gap Filler Pads For Medical Devices Product descriptions TlF 700RES Series thermally conductive interface materials are applied to fill theair gaps between the heating elements and the heat dissipation fins or the metalbase.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-51795670-tif100-40-11u-thermal-pad-for-gpu-cpu-chip-for-power-tools.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl202622293-tif100_40_11u_thermal_pad_for_gpu_cpu_chip_for_power_tools.jpg https://www.ziitek.com.vn/photo/pl202622292-tif100_40_11u_thermal_pad_for_gpu_cpu_chip_for_power_tools.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-40-11U Thermal Pad For GPU CPU Chip For Power Tools Thermal Pad For GPU CPU Chip For Power Tools The TIF 100-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-54426811-tif700pus-self-adhesive-gray-thermal-silicone-conductive-pad-7-5w-for-ai-processors-ai-servers-heat-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl211718996-tif700pus_self_adhesive_gray_thermal_silicone_conductive_pad_7_5w_for_ai_processors_ai_servers_heat_dissipation.jpg https://www.ziitek.com.vn/photo/pl211718995-tif700pus_self_adhesive_gray_thermal_silicone_conductive_pad_7_5w_for_ai_processors_ai_servers_heat_dissipation.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF700PUS Self-Adhesive Gray Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation TIF700PUS Self-Adhesive Gray Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation Product descriptions The TIF 700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.7 https://www.ziitek.com.vn/sale-53008180-tif100c-7545-11-premium-soft-7-5w-silicone-thermal-pad-for-advanced-cooling-needs.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204925334-tif100c_7545_11_premium_soft_7_5w_silicone_thermal_pad_for_advanced_cooling_needs.jpg https://www.ziitek.com.vn/photo/pl204925335-tif100c_7545_11_premium_soft_7_5w_silicone_thermal_pad_for_advanced_cooling_needs.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 7545-11 Premium Soft 7.5W Silicone Thermal Pad For Advanced Cooling Needs TIF100C 7545-11 Premium Soft 7.5W Silicone Thermal Pad For Advanced Cooling Needs Product descriptions TIF 100C 7545-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-52824140-tif100-50-11us-5-0w-thermal-silicone-pad-thermal-conductive-gap-filler-silicone-pad-high-conductive-.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204677222-tif100_50_11us_5_0w_thermal_silicone_pad_thermal_conductive_gap_filler_silicone_pad_high_conductive_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/pl204677221-tif100_50_11us_5_0w_thermal_silicone_pad_thermal_conductive_gap_filler_silicone_pad_high_conductive_silicone_thermal_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100-50-11US 5.0W Thermal Silicone Pad Thermal Conductive Gap Filler Silicone Pad High Conductive Silicone Thermal Pad 5.0W Thermal Silicone Pad Thermal Conductive Gap Filler Silicone Pad High Conductive Silicone Thermal Pad Product descriptions TlF 100-50-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 5.0W/mK > Moldability for complex parts > Soft and https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-52813723-tif100c-6050-11-excellent-thermal-conductivity-6-0w-mk-thermal-conductive-sheet-for-cpu-and-gpu-proc.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204637453-tif100c_6050_11_excellent_thermal_conductivity_6_0w_mk_thermal_conductive_sheet_for_cpu_and_gpu_processors.jpg https://www.ziitek.com.vn/photo/pl204637455-tif100c_6050_11_excellent_thermal_conductivity_6_0w_mk_thermal_conductive_sheet_for_cpu_and_gpu_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 6050-11 Excellent Thermal Conductivity 6.0W/MK Thermal Conductive Sheet For CPU And GPU Processors TIF100C 6050-11 Excellent Thermal Conductivity 6.5W/MK Thermal Conductive Sheet For CPU And GPU Processors Product descriptions TS-TIF 100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.3 https://www.ziitek.com.vn/sale-54154761-tif500-18-11us-good-softness-and-filling-properties-thermally-silicone-pad-for-ai.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl209323280-tif500_18_11us_good_softness_and_filling_properties_thermally_silicone_pad_for_ai.jpg https://www.ziitek.com.vn/photo/pl209323279-tif500_18_11us_good_softness_and_filling_properties_thermally_silicone_pad_for_ai.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF500-18-11US Good softness and filling properties Thermally Silicone Pad For AI Good softness and filling properties Thermally Silicone Pad For AI The TIF 500-18-11US Series is a universal thermal pad with balanced performance.It provides good thermal conductivity and moderate hardness. This balanced design combines good surface adhesion and excellent operational convenience, providing effective heat transfer paths and basic physical protection for a wide range of electronic components.The ideal choice for addressing the needs of medium to high power https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-53005508-tif100c-10075-11-silicone-thermal-pad-insulation-materail-pads-electronic-products-thermal-gap-fille.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204922716-tif100c_10075_11_silicone_thermal_pad_insulation_materail_pads_electronic_products_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/pl204922717-tif100c_10075_11_silicone_thermal_pad_insulation_materail_pads_electronic_products_thermal_gap_filler_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 10075-11 Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad TIF100C 10075-11 Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad Product descriptions TIF 100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.4 https://www.ziitek.com.vn/sale-52842222-tif100c-3030-11-custom-high-performance-cpu-silicone-high-thermal-conductivity-pad-thermal-gap-fille.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204748879-tif100c_3030_11_custom_high_performance_cpu_silicone_high_thermal_conductivity_pad_thermal_gap_filler_factory.jpg https://www.ziitek.com.vn/photo/pl204748878-tif100c_3030_11_custom_high_performance_cpu_silicone_high_thermal_conductivity_pad_thermal_gap_filler_factory.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 3030-11 Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory TIF100C 3030-11 Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory Product descriptions TS-TIF 100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.1 https://www.ziitek.com.vn/sale-52842190-tif100c-5045-11-good-heat-dissipation-thermal-pad-battery-thermal-pads-for-ev-batteries-protection.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204748577-tif100c_5045_11_good_heat_dissipation_thermal_pad_battery_thermal_pads_for_ev_batteries_protection.jpg https://www.ziitek.com.vn/photo/pl204748576-tif100c_5045_11_good_heat_dissipation_thermal_pad_battery_thermal_pads_for_ev_batteries_protection.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 5045-11 Good Heat Dissipation Thermal Pad Battery Thermal Pads For EV Batteries Protection TIF100C 5045-11 Good Heat Dissipation Thermal Pad Battery Thermal Pads For EV Batteries Protection Product descriptions TS-TIF 100C 5045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.6 https://www.ziitek.com.vn/sale-52833782-tif800hs-thermal-conductivity-self-adhesive-silicone-thermal-pads-for-high-temperature-applications.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204718949-tif800hs_thermal_conductivity_self_adhesive_silicone_thermal_pads_for_high_temperature_applications.jpg https://www.ziitek.com.vn/photo/pl204718950-tif800hs_thermal_conductivity_self_adhesive_silicone_thermal_pads_for_high_temperature_applications.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF800HS Thermal Conductivity Self-Adhesive Silicone Thermal Pads For High Temperature Applications TIF 800HS Thermal Conductivity Self-Adhesive Silicone Thermal Pads For High Temperature Applications Product descriptions TlF 800HS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive:15.0W/mK > https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.8 https://www.ziitek.com.vn/sale-52813611-tif100c-6530-11-excellent-thermal-conductivity-6-5w-mk-thermal-gap-filler-pad-for-cpu-and-gpu-proces.html 0.8 weekly 2026-02-27 https://www.ziitek.com.vn/photo/pl204636859-tif100c_6530_11_excellent_thermal_conductivity_6_5w_mk_thermal_gap_filler_pad_for_cpu_and_gpu_processors.jpg https://www.ziitek.com.vn/photo/pl204636860-tif100c_6530_11_excellent_thermal_conductivity_6_5w_mk_thermal_gap_filler_pad_for_cpu_and_gpu_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/cool-your-tech-fast-421273.jpg TIF100C 6530-11 Excellent Thermal Conductivity 6.5W/MK Thermal Gap Filler Pad For CPU And GPU Processors TIF100C 6530-11 Excellent Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF 100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to https://www.ziitek.com.vn/vodcdn/videos/encoder/1202602/73e5d7c42022fc4c035cb5c72f55ad73/playlist.m3u8 14 2026-02-27T14:54:46+08:00 4 4.5 https://www.ziitek.com.vn/sale-54714514-tif500-30-11es-ultra-soft-thermal-pad-3-0w-high-performance-silicone-gap-pads-for-electronic-compone.html 0.8 weekly 2026-02-13 https://www.ziitek.com.vn/photo/pl213618118-tif500_30_11es_ultra_soft_thermal_pad_3_0w_high_performance_silicone_gap_pads_for_electronic_components.jpg https://www.ziitek.com.vn/photo/pl213618119-tif500_30_11es_ultra_soft_thermal_pad_3_0w_high_performance_silicone_gap_pads_for_electronic_components.jpg https://www.ziitek.com.vn/sale-54666821-tif500-28-11u-2-8w-ai-server-ultra-soft-thermal-pads-high-quality-thermal-conductivity-insulated-pad.html 0.8 weekly 2026-02-09 https://www.ziitek.com.vn/photo/pl213551108-tif500_28_11u_2_8w_ai_server_ultra_soft_thermal_pads_high_quality_thermal_conductivity_insulated_pad.jpg https://www.ziitek.com.vn/photo/pl213551109-tif500_28_11u_2_8w_ai_server_ultra_soft_thermal_pads_high_quality_thermal_conductivity_insulated_pad.jpg https://www.ziitek.com.vn/sale-52181722-tif500-20-11us-gray-silicon-thermal-pad-for-high-speed-mass-storage-drives.html 0.8 weekly 2026-02-09 https://www.ziitek.com.vn/photo/pl213540259-tif500_20_11us_gray_silicon_thermal_pad_for_high_speed_mass_storage_drives.jpg https://www.ziitek.com.vn/photo/pl213540260-tif500_20_11us_gray_silicon_thermal_pad_for_high_speed_mass_storage_drives.jpg https://www.ziitek.com.vn/sale-52181500-tif500-20-11u-thermally-conductive-sheet-pads-silicon-thermal-pad-for-cooling-components-to-the-chas.html 0.8 weekly 2026-02-06 https://www.ziitek.com.vn/photo/pl203757871-tif500_20_11u_thermally_conductive_sheet_pads_silicon_thermal_pad_for_cooling_components_to_the_chassis_of_frame.jpg https://www.ziitek.com.vn/photo/pl203757870-tif500_20_11u_thermally_conductive_sheet_pads_silicon_thermal_pad_for_cooling_components_to_the_chassis_of_frame.jpg https://www.ziitek.com.vn/sale-52182146-tif500-18-11u-insulation-gray-silicon-thermal-pad-for-rdram-memory-modules.html 0.8 weekly 2026-02-06 https://www.ziitek.com.vn/photo/pl203759671-tif500_18_11u_insulation_gray_silicon_thermal_pad_for_rdram_memory_modules.jpg https://www.ziitek.com.vn/photo/pl213532202-tif500_18_11u_insulation_gray_silicon_thermal_pad_for_rdram_memory_modules.jpg https://www.ziitek.com.vn/photo/pl213532201-tif500_18_11u_insulation_gray_silicon_thermal_pad_for_rdram_memory_modules.jpg https://www.ziitek.com.vn/sale-54660948-tif500-high-electrical-insulation-and-self-adhesiveness-thermal-pad-for-5g-aerospace-ai-aiot-ar-vr-m.html 0.8 weekly 2026-02-06 https://www.ziitek.com.vn/photo/pl213522239-tif500_high_electrical_insulation_and_self_adhesiveness_thermal_pad_for_5g_aerospace_ai_aiot_ar_vr_mr_xr.jpg https://www.ziitek.com.vn/photo/pl213522241-tif500_high_electrical_insulation_and_self_adhesiveness_thermal_pad_for_5g_aerospace_ai_aiot_ar_vr_mr_xr.jpg https://www.ziitek.com.vn/photo/ziitek/video/led-overheating-get-cooling-406267.jpg TIF500 High Electrical Insulation And Self-Adhesiveness Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR High Electrical Insulation And Self-Adhesiveness Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Product descriptions The TIF 500 Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/9779a10c0ef416b67d619cb89417964e/playlist.m3u8 11 2026-01-14T10:23:10+08:00 6 4.3 https://www.ziitek.com.vn/sale-54635210-tif200-04es-extremely-soft-thermally-conductive-silicon-thermal-pad-1-0-w-mk-heat-resistant-thermal-.html 0.8 weekly 2026-02-06 https://www.ziitek.com.vn/photo/pl213481377-tif200_04es_extremely_soft_thermally_conductive_silicon_thermal_pad_1_0_w_mk_heat_resistant_thermal_gap_pad.jpg https://www.ziitek.com.vn/photo/pl213481379-tif200_04es_extremely_soft_thermally_conductive_silicon_thermal_pad_1_0_w_mk_heat_resistant_thermal_gap_pad.jpg https://www.ziitek.com.vn/sale-54588568-tif100-66u-ultra-soft-and-good-compressibility-1-5w-thermally-conductive-gap-filler-pads-for-5g-aero.html 0.8 weekly 2026-02-03 https://www.ziitek.com.vn/photo/pl213340047-tif100_66u_ultra_soft_and_good_compressibility_1_5w_thermally_conductive_gap_filler_pads_for_5g_aerospace_ai.jpg https://www.ziitek.com.vn/photo/pl213340046-tif100_66u_ultra_soft_and_good_compressibility_1_5w_thermally_conductive_gap_filler_pads_for_5g_aerospace_ai.jpg https://www.ziitek.com.vn/quality-53971105-tif200-20-18u-high-strength-high-temperature-resistant-thermal-silicon-insulator-pad-for-battery 0.8 weekly 2026-01-28 https://www.ziitek.com.vn/photo/pl208451634-tif200_20_18u_high_strength_high_temperature_resistant_thermal_silicon_insulator_pad_for_battery.jpg https://www.ziitek.com.vn/photo/pl208451635-tif200_20_18u_high_strength_high_temperature_resistant_thermal_silicon_insulator_pad_for_battery.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF200-20-18U High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad For Battery TIF200-20-18U High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad For Battery Product descriptions TlF 200-20-18U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for complex https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.2 https://www.ziitek.com.vn/quality-52156866-tif500-thermal-pad-2-6w-mk-silicon-thermal-gap-pad-filling-for-auditioning-electronic-products 0.8 weekly 2026-01-28 https://www.ziitek.com.vn/photo/pl203677006-tif500_thermal_pad_2_6w_mk_silicon_thermal_gap_pad_filling_for_auditioning_electronic_products.jpg https://www.ziitek.com.vn/photo/pl203677007-tif500_thermal_pad_2_6w_mk_silicon_thermal_gap_pad_filling_for_auditioning_electronic_products.jpg https://www.ziitek.com.vn/photo/ziitek/video/led-overheating-get-cooling-406267.jpg TIF500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products TIF 500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products Product descriptions TlF 500 series is an extremely soft gap filling material rated at a thermal conductivity of 2.6W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF 500 is highly https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/9779a10c0ef416b67d619cb89417964e/playlist.m3u8 11 2026-01-14T10:23:10+08:00 6 4.6 https://www.ziitek.com.vn/quality-52571394-tif700p-thermal-pad-gpu-cpu-heatsink-cooling-conductive-silicone-thermal-gap-filler 0.8 weekly 2026-01-28 https://www.ziitek.com.vn/photo/pl204254012-tif700p_thermal_pad_gpu_cpu_heatsink_cooling_conductive_silicone_thermal_gap_filler.jpg https://www.ziitek.com.vn/photo/pl204254013-tif700p_thermal_pad_gpu_cpu_heatsink_cooling_conductive_silicone_thermal_gap_filler.jpg https://www.ziitek.com.vn/sale-54473463-tif700uu-computer-cpu-gpu-cooling-gap-pads-high-performance-10-0w-thermal-gap-pad-materials-for-al-s.html 0.8 weekly 2026-01-15 https://www.ziitek.com.vn/photo/pl212235477-tif700uu_computer_cpu_gpu_cooling_gap_pads_high_performance_10_0w_thermal_gap_pad_materials_for_al_servers.jpg https://www.ziitek.com.vn/photo/pl212235476-tif700uu_computer_cpu_gpu_cooling_gap_pads_high_performance_10_0w_thermal_gap_pad_materials_for_al_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/led-overheating-get-cooling-406267.jpg TIF700UU Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers TIF 700UU Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers The TIF 700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/9779a10c0ef416b67d619cb89417964e/playlist.m3u8 11 2026-01-14T10:23:10+08:00 6 4.5 https://www.ziitek.com.vn/sale-53236361-tif100n-25-16s-premium-soft-2-5w-blue-violet-silicone-thermal-pad-for-electronic-equipment.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl205657665-tif100n_25_16s_premium_soft_2_5w_blue_violet_silicone_thermal_pad_for_electronic_equipment.jpg https://www.ziitek.com.vn/photo/pl205657666-tif100n_25_16s_premium_soft_2_5w_blue_violet_silicone_thermal_pad_for_electronic_equipment.jpg https://www.ziitek.com.vn/photo/ziitek/video/led-overheating-get-cooling-406267.jpg TIF100N-25-16S Premium Soft 2.5W Blue-Violet Silicone Thermal Pad For Electronic Equipment TIF100N-25-16S Premium Soft 2.5W Blue-Violet Silicone Thermal Pad For Electronic Equipment Product descriptions TIF 100N-25-16S series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/9779a10c0ef416b67d619cb89417964e/playlist.m3u8 11 2026-01-14T10:23:10+08:00 6 4.3 https://www.ziitek.com.vn/sale-54142872-tif100-15-16s-multiple-thickness-hardness-factory-thermal-silicone-pad-for-led-lighting-fixtures.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl209204201-tif100_15_16s_multiple_thickness_hardness_factory_thermal_silicone_pad_for_led_lighting_fixtures.jpg https://www.ziitek.com.vn/photo/pl209204200-tif100_15_16s_multiple_thickness_hardness_factory_thermal_silicone_pad_for_led_lighting_fixtures.jpg https://www.ziitek.com.vn/photo/ziitek/video/led-overheating-get-cooling-406267.jpg TIF100-15-16S Multiple Thickness Hardness Factory Thermal Silicone Pad For LED Lighting Fixtures TIF100-15-16S Multiple Thickness Hardness Factory Thermal Silicone Pad For LED Lighting Fixtures The TIF 100-15-16S Series a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/9779a10c0ef416b67d619cb89417964e/playlist.m3u8 11 2026-01-14T10:23:10+08:00 6 4.8 https://www.ziitek.com.vn/sale-53220622-tif100-19s-thermally-conductive-silicone-pads-black-thermal-pad-for-heatsink-cooller.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl205609248-tif100_19s_thermally_conductive_silicone_pads_black_thermal_pad_for_heatsink_cooller.jpg https://www.ziitek.com.vn/photo/pl205609249-tif100_19s_thermally_conductive_silicone_pads_black_thermal_pad_for_heatsink_cooller.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF100-19S Thermally Conductive Silicone Pads Black Thermal Pad For Heatsink Cooller TIF100-19S Thermally Conductive Silicone Pads Black Thermal Pad For Heatsink Cooller Product descriptions TlFTM100-019S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.8 https://www.ziitek.com.vn/sale-53089242-tif100-19u-customized-thermal-conductive-silicone-insulation-pad-for-memory-modules.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl205067739-tif100_19u_customized_thermal_conductive_silicone_insulation_pad_for_memory_modules.jpg https://www.ziitek.com.vn/photo/pl205067740-tif100_19u_customized_thermal_conductive_silicone_insulation_pad_for_memory_modules.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF100-19U Customized Thermal Conductive Silicone Insulation Pad for Memory Modules TIF100-19U Customized Thermal Conductive Silicone Insulation Pad for Memory Modules Product descriptions TlF100-19U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1.5W/mK > Naturally tacky https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.5 https://www.ziitek.com.vn/sale-52168568-tif-100-20-19f-high-quality-high-performance-heat-desipition-insulated-thermal-pad-for-electronics-c.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl203715027-tif_100_20_19f_high_quality_high_performance_heat_desipition_insulated_thermal_pad_for_electronics_cooling.jpg https://www.ziitek.com.vn/photo/pl203715725-tif_100_20_19f_high_quality_high_performance_heat_desipition_insulated_thermal_pad_for_electronics_cooling.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF-100-20-19F High Quality High Performance Heat Desipition Insulated Thermal Pad For Electronics Cooling High Quality High Performance Heat Desipition Insulated Thermal Pad For Electronics Cooling Product descriptions TlF 100-20-19F is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF 100-20-19F is an electrically isolating material, which allows its use in applications requiring isolation between heat https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.2 https://www.ziitek.com.vn/sale-52081906-tif100-15-27e-fast-production-high-quality-custom-made-thermal-conductive-silicon-pad-for-monitoring.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl203373909-tif100_15_27e_fast_production_high_quality_custom_made_thermal_conductive_silicon_pad_for_monitoring_the_power_box.jpg https://www.ziitek.com.vn/photo/pl203373910-tif100_15_27e_fast_production_high_quality_custom_made_thermal_conductive_silicon_pad_for_monitoring_the_power_box.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF100-15-27E Fast Production High Quality Custom Made Thermal Conductive Silicon Pad For Monitoring The Power Box Fast Production High Quality Custom Made Thermal Conductive Silicon Pad For Monitoring The Power Box Product descriptions TlF 100-15-27E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.1 https://www.ziitek.com.vn/sale-54306434-high-insulation-performance-thermally-conductive-gap-filler-pads-for-automotive-electronics-ai-proce.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl210857689-high_insulation_performance_thermally_conductive_gap_filler_pads_for_automotive_electronics_ai_processors.jpg https://www.ziitek.com.vn/photo/pl210857690-high_insulation_performance_thermally_conductive_gap_filler_pads_for_automotive_electronics_ai_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg High Insulation Performance Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors High Insulation Performance Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors Product descriptions TIF 200-15-27E Seriesis a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and soft characteristics.This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.1 https://www.ziitek.com.vn/sale-54440253-tif100-20-19s-soft-thermal-pad-electrically-insulating-pad-with-exceptional-thermal-conductivity-for.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl211888806-tif100_20_19s_soft_thermal_pad_electrically_insulating_pad_with_exceptional_thermal_conductivity_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/pl211888807-tif100_20_19s_soft_thermal_pad_electrically_insulating_pad_with_exceptional_thermal_conductivity_for_ai_processors_ai_servers.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF100-20-19S Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers TIF100-20-19S Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers Product descriptions The TIF 100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.8 https://www.ziitek.com.vn/sale-51842415-tif400-yellow-2-0w-thermal-conductivity-silicone-thermal-pads-for-telecommunication-hardware.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl202778387-tif400_yellow_2_0w_thermal_conductivity_silicone_thermal_pads_for_telecommunication_hardware.jpg https://www.ziitek.com.vn/photo/pl202778388-tif400_yellow_2_0w_thermal_conductivity_silicone_thermal_pads_for_telecommunication_hardware.jpg https://www.ziitek.com.vn/photo/ziitek/video/ai-server-overheating-solved-406264.jpg TIF400 Yellow 2.0W Thermal Conductivity Silicone Thermal Pads For Telecommunication Hardware TIF 400 Yellow 2.0W Thermal Conductivity Silicone Thermal Pads For Telecommunication Hardware Product descriptions TlF 400 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/babd6568d4c545240e997ac3f0b96657/playlist.m3u8 10 2026-01-14T10:19:20+08:00 4 4.1 https://www.ziitek.com.vn/sale-51811046-tif100-45-56s-silicone-thermal-pad-for-gpu-cpu-chip.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl202664826-tif100_45_56s_silicone_thermal_pad_for_gpu_cpu_chip.jpg https://www.ziitek.com.vn/photo/pl202664827-tif100_45_56s_silicone_thermal_pad_for_gpu_cpu_chip.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg TIF100-45-56S Silicone Thermal Pad For GPU CPU Chip TIF100-45-56S Silicone Thermal Pad For GPU CPU Chip Ziitek TIF 100-45-56S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good thermal conductive: 4.5W/mK > Good thermal conductivity > Naturally tacky needing no https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.6 https://www.ziitek.com.vn/sale-52055642-electrically-insulated-tif100-07e-silicone-thermal-pad-thermally-conductive-silicon-material-for-dis.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl203282322-electrically_insulated_tif100_07e_silicone_thermal_pad_thermally_conductive_silicon_material_for_display_card.jpg https://www.ziitek.com.vn/photo/pl203282323-electrically_insulated_tif100_07e_silicone_thermal_pad_thermally_conductive_silicon_material_for_display_card.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg Electrically Insulated TIF100-07E Silicone Thermal Pad Thermally Conductive Silicon Material For Display Card Electrically Insulated TIF 100-07E Silicone Thermal Pad Thermally Conductive Silicon Material For Display Card Product descriptions TlF 100-07E series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivi https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.4 https://www.ziitek.com.vn/sale-51768678-tif100-66u-custom-laptop-hard-drive-gpu-cpu-thermal-conductive-pad.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl202498967-tif100_66u_custom_laptop_hard_drive_gpu_cpu_thermal_conductive_pad.jpg https://www.ziitek.com.vn/photo/pl202498964-tif100_66u_custom_laptop_hard_drive_gpu_cpu_thermal_conductive_pad.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg TIF100-66U Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad The TIF 100-66U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.2 https://www.ziitek.com.vn/sale-51827701-tif100-07u-bridging-gaps-1-5w-laptop-silicone-thermal-pads.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl202726045-tif100_07u_bridging_gaps_1_5w_laptop_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/pl202726044-tif100_07u_bridging_gaps_1_5w_laptop_silicone_thermal_pads.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg TIF100-07U Bridging Gaps 1.5W Laptop Silicone Thermal Pads TIF 100-07U Bridging Gaps 1.5W Laptop Silicone Thermal Pads Product descriptions TlF 100-07U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.8 https://www.ziitek.com.vn/sale-54172164-tif100-50-56e-ul-94-v0-flame-rating-conductive-pad-for-gpu-cooling-high-quality-thermal-conductive-p.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl209433124-tif100_50_56e_ul_94_v0_flame_rating_conductive_pad_for_gpu_cooling_high_quality_thermal_conductive_pad_for_ai_processors.jpg https://www.ziitek.com.vn/photo/pl209433123-tif100_50_56e_ul_94_v0_flame_rating_conductive_pad_for_gpu_cooling_high_quality_thermal_conductive_pad_for_ai_processors.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg TIF100-50-56E UL-94 V0 Flame Rating Conductive Pad For GPU Cooling High Quality Thermal Conductive Pad For AI Processors TIF100-50-56E UL-94 V0 Flame Rating Conductive Pad For GPU Cooling High Quality Thermal Conductive Pad For AI Processors The TIF 100-50-56E Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.6 https://www.ziitek.com.vn/sale-53335421-tif100-18-56e-high-conductivity-heat-transfer-silicone-thermal-pads-for-mainboard-mother-board.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl205972807-tif100_18_56e_high_conductivity_heat_transfer_silicone_thermal_pads_for_mainboard_mother_board.jpg https://www.ziitek.com.vn/photo/pl205972808-tif100_18_56e_high_conductivity_heat_transfer_silicone_thermal_pads_for_mainboard_mother_board.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg TIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board TIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board Product descriptions TlFTM100-18-56E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45 ~200 and meet the requirement of UL94V0. Features > Good thermal conductive 1.8W/mK > Moldability for complex parts > Soft and compressible https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.4 https://www.ziitek.com.vn/sale-53426229-tif100-20-18s-heat-transfer-thermal-interface-materials-thermal-conductive-silicone-thermal-gap-fill.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl206332965-tif100_20_18s_heat_transfer_thermal_interface_materials_thermal_conductive_silicone_thermal_gap_filler_pad_for_pcb.jpg https://www.ziitek.com.vn/photo/pl206332966-tif100_20_18s_heat_transfer_thermal_interface_materials_thermal_conductive_silicone_thermal_gap_filler_pad_for_pcb.jpg https://www.ziitek.com.vn/photo/ziitek/video/gpu-overheating-solved-406260.jpg TIF100-20-18S Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb TIF100-20-18S Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb Product descriptions TlFTM100-20-18S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness https://www.ziitek.com.vn/vodcdn/videos/encoder/1202601/b17ecbb8288f6c7b97ddfdb35c990e58/playlist.m3u8 13 2026-01-14T10:17:03+08:00 4 4.2 https://www.ziitek.com.vn/sale-54160908-tif500-50-11us-thermal-silicone-pad-5-0w-high-conductivity-heat-dissipation-sheet-for-ai-servers-inv.html 0.8 weekly 2026-01-14 https://www.ziitek.com.vn/photo/pl209356101-tif500_50_11us_thermal_silicone_pad_5_0w_high_conductivity_heat_dissipation_sheet_for_ai_servers_inverters_telecom_devices.jpg 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